Solder Powder / Tin Powder
Solder Powder / Tin Powder
A complete solder powder and tin powder series for solder paste manufacturing, precision alloy powder applications, electronic materials and specialty soldering processes.
Alloy powder options for solder paste and precision electronics
Jufeng Solder supplies multiple alloy systems and particle grades for customers developing solder paste, electronic assembly materials, specialty joining products and low alpha solutions.
Wide Alloy Coverage
Includes Sn-Sb, Sn-Ag, SAC, Sn-Bi, Sn-Pb, Au-Sn, Sn-Cu, pure tin and high-lead powder options.
Type 3 to Type 9
Multiple particle size grades support solder paste printing, dispensing and selected micro-deposition requirements.
Lead-Free & Leaded Options
Choose from lead-free, leaded and specialty alloy systems according to process and compliance requirements.
Low Alpha Supply
Selected low alpha and ultra-low alpha solder powder options can be discussed for sensitive electronic applications.
Stable Powder Supply
Controlled composition and particle grade selection support repeatable paste formulation and production evaluation.
Export Packaging
Standard supply is 5 kg per bag and 4 bags per box, with application requirements reviewed before shipment.
Series Overview
Use the information below for initial alloy and particle grade selection, then confirm paste formulation, process profile, alpha requirement and packaging before production.
How to Select
Start with the required alloy and melting point, then select particle grade according to stencil opening, deposit volume, printing or dispensing method and reliability target.
Available Solder Powder Models
Each alloy is presented as an individual product item with its melting point, particle size range and dedicated product page.
Sn90Sb10
Higher-temperature Sn-Sb solder powder.
Sn95Sb5
Tin-antimony solder powder for stable higher-temperature processing.
Sn96.5Ag3.5
Lead-free silver-bearing solder powder.
Sn96.5Ag3.0Cu0.5
SAC305 solder powder for lead-free paste manufacturing.
Sn99Ag0.3Cu0.7
SAC0307 solder powder with broad particle size options.
Sn64Bi35Ag1
Reduced-temperature Sn-Bi-Ag solder powder.
Sn42Bi57Ag1
Low-temperature Sn-Bi-Ag solder powder.
Sn42Bi57.6Ag0.4
Low-temperature Sn-Bi-Ag powder for heat-sensitive processes.
Sn42Bi58
Low-temperature eutectic-type Sn-Bi solder powder.
Sn63Pb37
Eutectic tin-lead solder powder for controlled specialty use.
Sn60Pb40
Tin-lead solder powder for solder paste and legacy processes.
Sn62Pb36Ag2
Silver-containing tin-lead solder powder.
Sn62Pb36.8Ag0.4
Tin-lead-silver powder for defined soldering profiles.
Sn69Bi30Cu0.5
Specialty Sn-Bi-Cu solder powder.
Sn59.5Bi40Cu0.1
Reduced-temperature specialty Sn-Bi-Cu powder.
Au80Sn20
Au80Sn20 solder powder for high-reliability packaging.
Sn99.3Cu0.7
Lead-free Sn-Cu solder powder for cost-conscious production.
Sn100
Pure tin powder for specialty electronic material applications.
Sn10Pb90
High-temperature high-lead solder powder.
Sn5Pb95
High-lead solder powder for high-temperature joining.
Sn5Pb92.5Ag2.5
High-lead silver-bearing solder powder.
Quick Technical Matrix
A mobile-friendly overview of the listed alloy models, melting points and available particle size grades.
Typical Applications
Solder powder selection should be validated together with flux chemistry, paste formulation, deposition method, reflow profile and end-use reliability requirements.
Need solder powder for your paste formulation?
Contact Jufeng Solder for alloy selection, particle size confirmation, low alpha options, samples, packaging and quotation support.
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