Sn96.5Ag3.5 Solder Powder / Tin Powder
Sn96.5Ag3.5 Solder Powder / Tin Powder
A lead-free tin-silver solder powder for solder paste production, precision printing and electronic assembly requiring a silver-bearing alloy system.
Lead-free tin-silver powder for precision solder paste production
This Sn-Ag powder combines a defined melting point with controlled particle grades for customers developing lead-free solder paste and specialty electronic materials.
Selectable Particle Grades
Available in Type 3, 4, 5 for suitable printing, dispensing and paste formulation requirements.
Stable Alloy Composition
Controlled alloy composition supports consistent melting behavior and repeatable material formulation.
Silver-bearing lead-free alloy
Provides a tin-silver alloy option for lead-free solder paste and engineered joining processes.
Low Alpha Option
Selected low alpha or ultra-low alpha supply can be discussed; availability must be confirmed for the chosen alloy and particle grade.
Export Packaging
Standard supply is 5 kg per bag and 4 bags per box for practical storage and international shipment.
Custom Supply Support
Particle grade, alpha level, packaging and application requirements can be reviewed before quotation and sample evaluation.
Product Specifications
Core alloy, melting point, particle size and packaging information for engineering review and quotation.
Recommended Use
Recommended for lead-free solder paste manufacturing, electronic assembly materials, printing and dispensing trials, and alloy-specific process development.
Typical Applications
Final suitability should be confirmed against paste formulation, substrate finish, stencil design, deposition method, reflow profile and reliability requirements.
Need Sn96.5Ag3.5 solder powder for your formulation?
Contact Jufeng Solder for particle size confirmation, low alpha options, sample evaluation, packaging and quotation support.
Want the product? Contact us!
