Sn90Sb10 Solder Powder / Tin Powder
Sn90Sb10 Solder Powder / Tin Powder
A tin-antimony solder powder for solder paste manufacturing and specialty electronic assembly where a higher joining temperature and stable alloy control are required.
Tin-antimony alloy powder for controlled higher-temperature soldering
This Sn-Sb solder powder is supplied for customers who require consistent alloy composition, defined melting behavior and selectable particle size grades for paste formulation, printing or dispensing.
Selectable Particle Grades
Available in Type 3, 4, 5 for suitable printing, dispensing and paste formulation requirements.
Stable Alloy Composition
Controlled alloy composition supports consistent melting behavior and repeatable material formulation.
Higher-temperature alloy system
Supports selected applications that need a higher melting point than conventional SAC and Sn-Bi systems.
Low Alpha Option
Selected low alpha or ultra-low alpha supply can be discussed; availability must be confirmed for the chosen alloy and particle grade.
Export Packaging
Standard supply is 5 kg per bag and 4 bags per box for practical storage and international shipment.
Custom Supply Support
Particle grade, alpha level, packaging and application requirements can be reviewed before quotation and sample evaluation.
Product Specifications
Core alloy, melting point, particle size and packaging information for engineering review and quotation.
Recommended Use
Recommended for higher-temperature solder paste formulation, electronic packaging, specialty assembly and process development where Sn-Sb alloy behavior is specified.
Typical Applications
Final suitability should be confirmed against paste formulation, substrate finish, stencil design, deposition method, reflow profile and reliability requirements.
Need Sn90Sb10 solder powder for your formulation?
Contact Jufeng Solder for particle size confirmation, low alpha options, sample evaluation, packaging and quotation support.
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