Sn60Pb40 Solder Powder / Tin Powder

Sn60Pb40 Solder Powder / Tin Powder
Sn60Pb40 solder powder is designed for solder paste production, SMT assembly, electronic packaging, and precision soldering applications. The powder can be supplied with different particle size grades according to printing, dispensing, or process requirements.
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Sn60Pb40 Solder Powder / Tin Powder

A tin-lead solder powder for solder paste production, legacy electronic assembly and specialty processes where the specified alloy remains permitted.

Sn60Pb40Tin-Lead
191°CMelting point
Type 3 · 4 · 5Particle size grades
Sn60Pb40 Solder Powder / Tin Powder
Sn60Pb40 Solder Powder / Tin Powder

Tin-lead powder for controlled legacy and specialty soldering

This Sn-Pb solder powder is supplied in Type 3, Type 4 and Type 5 grades for customers requiring stable alloy composition and defined melting behavior in permitted applications.

01

Selectable Particle Grades

Available in Type 3, 4, 5 for suitable printing, dispensing and paste formulation requirements.

02

Stable Alloy Composition

Controlled alloy composition supports consistent melting behavior and repeatable material formulation.

03

Defined Sn-Pb composition

Supports established soldering profiles and legacy production requirements where leaded alloys are specified and legally permitted.

04

Low Alpha Option

Selected low alpha or ultra-low alpha supply can be discussed; availability must be confirmed for the chosen alloy and particle grade.

05

Export Packaging

Standard supply is 5 kg per bag and 4 bags per box for practical storage and international shipment.

06

Custom Supply Support

Particle grade, alpha level, packaging and application requirements can be reviewed before quotation and sample evaluation.

Product Specifications

Core alloy, melting point, particle size and packaging information for engineering review and quotation.

Recommended Use

Recommended for permitted leaded solder paste production, legacy electronics, repair, specialty assembly and process-specific applications.

Product Name
Sn60Pb40 Solder Powder / Tin Powder
Alloy Model
Sn60Pb40
Alloy Family
Tin-Lead
Melting Point
191°C
Particle Size
Type 3 / 4 / 5
Low Alpha Option
Selected low alpha <0.01 cph/cm² or ultra-low alpha <0.002 cph/cm² options; confirm availability
Packaging
5 kg per bag; 4 bags per box; standard box size 18.5 × 18.5 × 18.5 cm
Typical Applications
Leaded Solder Paste, Legacy Electronics, Repair & Rework, Specialty Assembly

Typical Applications

Final suitability should be confirmed against paste formulation, substrate finish, stencil design, deposition method, reflow profile and reliability requirements.

Application 01Leaded Solder Paste
Application 02Legacy Electronics
Application 03Repair & Rework
Application 04Specialty Assembly
View the complete solder powder / tin powder series →

Need Sn60Pb40 solder powder for your formulation?

Contact Jufeng Solder for particle size confirmation, low alpha options, sample evaluation, packaging and quotation support.

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