If a 0201 component, miniature sensor lead or tiny PCB pad keeps flooding with solder, the problem may not be your hand, your iron or your temperature setting. The solder wire itself may simply be too thick for the joint.

As AI accelerators move beyond the kilowatt threshold, thermal management is becoming one of the most important challenges in advanced semiconductor packaging.

Industry pain points: why do via-fill materials keep failing?
In advanced semiconductor packaging, PCB via-filling, and microelectronic interconnection processes, engineers repeatedly run into the same set of problems:

With the rapid development of flexible electronics including RFID tags, flexible sensors and wearable devices, printing processes based on PET & PI substrates have achieved great progress. However, traditional conductive pastes still have obvious defects in mass production: weak adhesion, cracking after bending, unstable resistance and high comprehensive cost, restricting product upgrading.

As the new year unfolds with fresh possibilities, Jufeng begins its 2026 international journey with strong momentum. The first stop was NEPCON JAPAN 2026, where Jufeng presented the strength and innovation of Chinese brands to the global electronics manufacturing industry.

To further strengthen product traceability and protect the legitimate rights and interests of our customers, Jufeng hereby announces the official rollout of an anti-counterfeiting label on all Jufeng brand solder paste products.

As new energy vehicles, 5G communication and high-power electronics continue to grow, sintered silver is becoming an important next-generation die attach material for high-reliability electronic packaging.

As high-precision industries such as RF electronics and electronic communications continue to grow, the requirements for joining materials are becoming increasingly demanding.

Joinspire FC-325LA pressure silver sinter paste is designed for large-area silver sintering in SiC power module packaging, delivering high reliability, process stability and excellent long-term performance.

JFPMAg-02 pressure silver sinter paste is designed for high-performance SiC power module packaging, enabling direct bonding on bare copper surfaces while supporting cost reduction, reliability improvement and domestic material substitution.