Sn62Pb36.8Ag0.4 Solder Powder / Tin Powder
Sn62Pb36.8Ag0.4 Solder Powder / Tin Powder
A silver-containing tin-lead solder powder for solder paste formulation and specialty electronic assembly where this alloy composition is specified.
Sn-Pb-Ag powder for stable specialty soldering processes
This silver-bearing Sn-Pb alloy powder is supplied in controlled particle grades for paste production, printing, dispensing and permitted specialty applications.
Selectable Particle Grades
Available in Type 3, 4, 5 for suitable printing, dispensing and paste formulation requirements.
Stable Alloy Composition
Controlled alloy composition supports consistent melting behavior and repeatable material formulation.
Silver-containing alloy system
Provides a defined Sn-Pb-Ag composition for process profiles and joint requirements that specify silver-bearing leaded solder.
Low Alpha Option
Selected low alpha or ultra-low alpha supply can be discussed; availability must be confirmed for the chosen alloy and particle grade.
Export Packaging
Standard supply is 5 kg per bag and 4 bags per box for practical storage and international shipment.
Custom Supply Support
Particle grade, alpha level, packaging and application requirements can be reviewed before quotation and sample evaluation.
Product Specifications
Core alloy, melting point, particle size and packaging information for engineering review and quotation.
Recommended Use
Recommended for permitted Sn-Pb-Ag solder paste production, precision electronic assembly, repair and specialty joining.
Typical Applications
Final suitability should be confirmed against paste formulation, substrate finish, stencil design, deposition method, reflow profile and reliability requirements.
Need Sn62Pb36.8Ag0.4 solder powder for your formulation?
Contact Jufeng Solder for particle size confirmation, low alpha options, sample evaluation, packaging and quotation support.
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