Au80Sn20 Solder Powder / Tin Powder
Au80Sn20 Solder Powder / Tin Powder
Au80Sn20 gold-tin solder powder for high-reliability electronic packaging, precision die attach and specialty joining applications.
Gold-tin alloy powder for high-reliability electronic packaging
Au80Sn20 powder is supplied in Type 3, Type 4 and Type 5 grades for controlled paste formulation and precision deposition in applications where gold-tin alloy performance is specified.
Selectable Particle Grades
Available in Type 3, 4, 5 for suitable printing, dispensing and paste formulation requirements.
Stable Alloy Composition
Controlled alloy composition supports consistent melting behavior and repeatable material formulation.
High-reliability Au-Sn alloy
Suitable for selected hermetic, optoelectronic and high-reliability packaging processes after application-specific validation.
Low Alpha Option
Selected low alpha or ultra-low alpha supply can be discussed; availability must be confirmed for the chosen alloy and particle grade.
Export Packaging
Standard supply is 5 kg per bag and 4 bags per box for practical storage and international shipment.
Custom Supply Support
Particle grade, alpha level, packaging and application requirements can be reviewed before quotation and sample evaluation.
Product Specifications
Core alloy, melting point, particle size and packaging information for engineering review and quotation.
Recommended Use
Recommended for gold-tin solder paste formulation, optoelectronic packaging, die attach, hermetic assembly and specialty high-reliability bonding.
Typical Applications
Final suitability should be confirmed against paste formulation, substrate finish, stencil design, deposition method, reflow profile and reliability requirements.
Need Au80Sn20 solder powder for your formulation?
Contact Jufeng Solder for particle size confirmation, low alpha options, sample evaluation, packaging and quotation support.
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