Sn42Bi57.6Ag0.4 Solder Powder / Tin Powder
Sn42Bi57.6Ag0.4 Solder Powder / Tin Powder
A low-temperature tin-bismuth-silver solder powder for heat-sensitive assembly, step soldering and precision solder paste formulation.
Low-temperature Sn-Bi-Ag powder for sensitive electronic processes
With a 139°C melting point, this alloy powder supports low-temperature paste development where thermal exposure, warpage risk or staged soldering must be carefully managed.
Selectable Particle Grades
Available in Type 3, 4, 5 for suitable printing, dispensing and paste formulation requirements.
Stable Alloy Composition
Controlled alloy composition supports consistent melting behavior and repeatable material formulation.
139°C low-temperature alloy
Supports lower-temperature processing for suitable components, substrates and staged assembly sequences.
Low Alpha Option
Selected low alpha or ultra-low alpha supply can be discussed; availability must be confirmed for the chosen alloy and particle grade.
Export Packaging
Standard supply is 5 kg per bag and 4 bags per box for practical storage and international shipment.
Custom Supply Support
Particle grade, alpha level, packaging and application requirements can be reviewed before quotation and sample evaluation.
Product Specifications
Core alloy, melting point, particle size and packaging information for engineering review and quotation.
Recommended Use
Recommended for low-temperature solder paste, heat-sensitive modules, step soldering, repair and precision electronic assembly after process validation.
Typical Applications
Final suitability should be confirmed against paste formulation, substrate finish, stencil design, deposition method, reflow profile and reliability requirements.
Need Sn42Bi57.6Ag0.4 solder powder for your formulation?
Contact Jufeng Solder for particle size confirmation, low alpha options, sample evaluation, packaging and quotation support.
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