Sn99Ag0.3Cu0.7 Solder Powder / Tin Powder
Sn99Ag0.3Cu0.7 Solder Powder / Tin Powder
Sn99Ag0.3Cu0.7 solder powder is designed for solder paste production, SMT assembly, electronic packaging, and precision soldering applications. The powder can be supplied with different particle size grades according to printing, dispensing, or process requirements.
Stable solder powder for solder paste and precision assembly.
This Sn99Ag0.3Cu0.7 solder powder is a SAC solder powder for lead-free solder paste and SMT assembly. It is suitable for customers requiring consistent particle size distribution, stable alloy composition, and process-ready powder supply.
Multiple Particle Grades
Available particle size grades support different printing and dispensing processes.
Stable Alloy Composition
Controlled composition helps maintain consistent melting and soldering behavior.
Low Alpha Option
Low alpha solder powder can be supplied for sensitive electronic applications.
Export Packaging
5kg per bag, 4 bags per box for convenient storage and shipment.
Quick specification
| Product Name | Sn99Ag0.3Cu0.7 Solder Powder / Tin Powder |
| Melting Point | 217°C |
| Particle Size | Type 3, 4, 5, 6, 7, 8, 9 |
| Low Alpha Option | Low alpha solder powder available: <0.01 cph/cm² or <0.002 cph/cm² |
| Packaging | 5 kg per bag; 4 bags per box; box size 18.5 × 18.5 × 18.5 cm |
For solder paste production and electronic assembly.
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