Sn99Ag0.3Cu0.7 Solder Powder / Tin Powder
Sn99Ag0.3Cu0.7 Solder Powder / Tin Powder
A lead-free SAC solder powder with Type 3 through Type 9 particle size options for solder paste manufacturing, fine-pitch printing and advanced electronic assembly.
SAC solder powder with broad particle size coverage
This SAC alloy powder supports conventional and fine particle grades, helping paste formulators match stencil aperture, deposit size, printing method and process requirements.
Selectable Particle Grades
Available in Type 3, 4, 5, 6, 7, 8, 9 for suitable printing, dispensing and paste formulation requirements.
Stable Alloy Composition
Controlled alloy composition supports consistent melting behavior and repeatable material formulation.
Type 3 to Type 9 options
Broad particle size coverage supports standard SMT paste as well as selected fine-pitch and micro-deposition processes.
Low Alpha Option
Selected low alpha or ultra-low alpha supply can be discussed; availability must be confirmed for the chosen alloy and particle grade.
Export Packaging
Standard supply is 5 kg per bag and 4 bags per box for practical storage and international shipment.
Custom Supply Support
Particle grade, alpha level, packaging and application requirements can be reviewed before quotation and sample evaluation.
Product Specifications
Core alloy, melting point, particle size and packaging information for engineering review and quotation.
Recommended Use
Recommended for lead-free solder paste manufacturing, SMT stencil printing, fine-pitch assembly, dispensing and process development requiring SAC alloy powder.
Typical Applications
Final suitability should be confirmed against paste formulation, substrate finish, stencil design, deposition method, reflow profile and reliability requirements.
Need Sn99Ag0.3Cu0.7 solder powder for your formulation?
Contact Jufeng Solder for particle size confirmation, low alpha options, sample evaluation, packaging and quotation support.
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