Sn99.3Cu0.7 Solder Powder / Tin Powder
Sn99.3Cu0.7 Solder Powder / Tin Powder
A lead-free tin-copper solder powder for solder paste production and electronics assembly requiring a practical silver-free alloy option.
Lead-free Sn-Cu powder for practical solder paste supply
This Sn-Cu alloy powder is available in Type 3, Type 4 and Type 5 grades for solder paste formulation, printing and selected electronic assembly processes.
Selectable Particle Grades
Available in Type 3, 4, 5 for suitable printing, dispensing and paste formulation requirements.
Stable Alloy Composition
Controlled alloy composition supports consistent melting behavior and repeatable material formulation.
Silver-free lead-free alloy
Provides a practical lead-free alloy option for customers balancing process requirements and material cost.
Low Alpha Option
Selected low alpha or ultra-low alpha supply can be discussed; availability must be confirmed for the chosen alloy and particle grade.
Export Packaging
Standard supply is 5 kg per bag and 4 bags per box for practical storage and international shipment.
Custom Supply Support
Particle grade, alpha level, packaging and application requirements can be reviewed before quotation and sample evaluation.
Product Specifications
Core alloy, melting point, particle size and packaging information for engineering review and quotation.
Recommended Use
Recommended for lead-free solder paste manufacturing, electronic assembly materials, printing, dispensing and Sn-Cu process development.
Typical Applications
Final suitability should be confirmed against paste formulation, substrate finish, stencil design, deposition method, reflow profile and reliability requirements.
Need Sn99.3Cu0.7 solder powder for your formulation?
Contact Jufeng Solder for particle size confirmation, low alpha options, sample evaluation, packaging and quotation support.
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