Sn100 Solder Powder / Tin Powder

Sn100 Solder Powder / Tin Powder
Sn100 solder powder is designed for solder paste production, SMT assembly, electronic packaging, and precision soldering applications. The powder can be supplied with different particle size grades according to printing, dispensing, or process requirements.
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Sn100 Solder Powder / Tin Powder

Pure tin powder for specialty solder paste, alloy preparation, electronic materials and precision powder applications.

Sn100Pure Tin
232°CMelting point
Type 3 · 4 · 5Particle size grades
Sn100 Solder Powder / Tin Powder
Sn100 Solder Powder / Tin Powder

Pure tin powder for specialty electronic material processes

Sn100 powder is supplied in Type 3, Type 4 and Type 5 grades for customers requiring a pure tin feedstock in paste development, alloy preparation or specialty electronic applications.

01

Selectable Particle Grades

Available in Type 3, 4, 5 for suitable printing, dispensing and paste formulation requirements.

02

Stable Alloy Composition

Controlled alloy composition supports consistent melting behavior and repeatable material formulation.

03

Pure tin composition

Suitable as a defined tin powder feedstock for selected material, alloy and solder formulation requirements.

04

Low Alpha Option

Selected low alpha or ultra-low alpha supply can be discussed; availability must be confirmed for the chosen alloy and particle grade.

05

Export Packaging

Standard supply is 5 kg per bag and 4 bags per box for practical storage and international shipment.

06

Custom Supply Support

Particle grade, alpha level, packaging and application requirements can be reviewed before quotation and sample evaluation.

Product Specifications

Core alloy, melting point, particle size and packaging information for engineering review and quotation.

Recommended Use

Recommended for specialty paste formulation, alloy preparation, electronic material development and precision tin powder applications.

Product Name
Sn100 Solder Powder / Tin Powder
Alloy Model
Sn100
Alloy Family
Pure Tin
Melting Point
232°C
Particle Size
Type 3 / 4 / 5
Low Alpha Option
Selected low alpha <0.01 cph/cm² or ultra-low alpha <0.002 cph/cm² options; confirm availability
Packaging
5 kg per bag; 4 bags per box; standard box size 18.5 × 18.5 × 18.5 cm
Typical Applications
Specialty Paste Formulation, Alloy Preparation, Electronic Materials, Precision Tin Powder

Typical Applications

Final suitability should be confirmed against paste formulation, substrate finish, stencil design, deposition method, reflow profile and reliability requirements.

Application 01Specialty Paste Formulation
Application 02Alloy Preparation
Application 03Electronic Materials
Application 04Precision Tin Powder
View the complete solder powder / tin powder series →

Need Sn100 solder powder for your formulation?

Contact Jufeng Solder for particle size confirmation, low alpha options, sample evaluation, packaging and quotation support.

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