Sn64Bi35Ag1 Solder Powder / Tin Powder
Sn64Bi35Ag1 Solder Powder / Tin Powder
A reduced-temperature tin-bismuth-silver solder powder for paste manufacturing and electronic assembly processes that need lower thermal exposure.
Reduced-temperature Sn-Bi-Ag powder for controlled heat input
This Sn-Bi-Ag alloy powder is designed for paste formulators and electronics manufacturers seeking a lower joining temperature with selectable Type 3, Type 4 or Type 5 powder.
Selectable Particle Grades
Available in Type 3, 4, 5 for suitable printing, dispensing and paste formulation requirements.
Stable Alloy Composition
Controlled alloy composition supports consistent melting behavior and repeatable material formulation.
Reduced thermal exposure
The lower melting point can help limit heat input compared with conventional SAC soldering profiles.
Low Alpha Option
Selected low alpha or ultra-low alpha supply can be discussed; availability must be confirmed for the chosen alloy and particle grade.
Export Packaging
Standard supply is 5 kg per bag and 4 bags per box for practical storage and international shipment.
Custom Supply Support
Particle grade, alpha level, packaging and application requirements can be reviewed before quotation and sample evaluation.
Product Specifications
Core alloy, melting point, particle size and packaging information for engineering review and quotation.
Recommended Use
Recommended for reduced-temperature solder paste, heat-sensitive electronic assembly, step soldering, precision printing and process evaluation.
Typical Applications
Final suitability should be confirmed against paste formulation, substrate finish, stencil design, deposition method, reflow profile and reliability requirements.
Need Sn64Bi35Ag1 solder powder for your formulation?
Contact Jufeng Solder for particle size confirmation, low alpha options, sample evaluation, packaging and quotation support.
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