Sn42Bi58 Solder Powder / Tin Powder
Sn42Bi58 Solder Powder / Tin Powder
A 138°C tin-bismuth solder powder for low-temperature solder paste, heat-sensitive electronics and staged assembly processes.
138°C Sn-Bi powder for low-temperature solder paste
This Sn-Bi powder provides a low-melting alloy option in Type 3, Type 4 and Type 5 grades for paste formulation, printing and controlled rework applications.
Selectable Particle Grades
Available in Type 3, 4, 5 for suitable printing, dispensing and paste formulation requirements.
Stable Alloy Composition
Controlled alloy composition supports consistent melting behavior and repeatable material formulation.
138°C melting point
Helps reduce peak processing temperature for suitable low-temperature assembly requirements.
Low Alpha Option
Selected low alpha or ultra-low alpha supply can be discussed; availability must be confirmed for the chosen alloy and particle grade.
Export Packaging
Standard supply is 5 kg per bag and 4 bags per box for practical storage and international shipment.
Custom Supply Support
Particle grade, alpha level, packaging and application requirements can be reviewed before quotation and sample evaluation.
Product Specifications
Core alloy, melting point, particle size and packaging information for engineering review and quotation.
Recommended Use
Recommended for low-temperature solder paste manufacturing, heat-sensitive electronics, secondary soldering and controlled rework.
Typical Applications
Final suitability should be confirmed against paste formulation, substrate finish, stencil design, deposition method, reflow profile and reliability requirements.
Need Sn42Bi58 solder powder for your formulation?
Contact Jufeng Solder for particle size confirmation, low alpha options, sample evaluation, packaging and quotation support.
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