Sn10Pb90 Solder Powder / Tin Powder

Sn10Pb90 Solder Powder / Tin Powder
Sn10Pb90 solder powder is designed for solder paste production, SMT assembly, electronic packaging, and precision soldering applications. The powder can be supplied with different particle size grades according to printing, dispensing, or process requirements.
Quantity
Contact Now

Sn10Pb90 Solder Powder / Tin Powder

A high-lead solder powder for high-temperature solder paste and specialty joining processes where the alloy is specified and legally permitted.

Sn10Pb90High-Lead Tin-Lead
302°CMelting point
Type 3 · 4 · 5Particle size grades
Sn10Pb90 Solder Powder / Tin Powder
Sn10Pb90 Solder Powder / Tin Powder

High-lead powder for high-temperature specialty joining

This high-lead Sn-Pb powder provides a high melting point and controlled Type 3, Type 4 or Type 5 particle grades for permitted high-temperature paste and step-soldering processes.

01

Selectable Particle Grades

Available in Type 3, 4, 5 for suitable printing, dispensing and paste formulation requirements.

02

Stable Alloy Composition

Controlled alloy composition supports consistent melting behavior and repeatable material formulation.

03

High-temperature alloy system

Supports selected joining sequences that require a solder alloy with a substantially higher melting point.

04

Low Alpha Option

Selected low alpha or ultra-low alpha supply can be discussed; availability must be confirmed for the chosen alloy and particle grade.

05

Export Packaging

Standard supply is 5 kg per bag and 4 bags per box for practical storage and international shipment.

06

Custom Supply Support

Particle grade, alpha level, packaging and application requirements can be reviewed before quotation and sample evaluation.

Product Specifications

Core alloy, melting point, particle size and packaging information for engineering review and quotation.

Recommended Use

Recommended for permitted high-temperature solder paste, step soldering, die attach, power electronics and specialty assembly after process validation.

Product Name
Sn10Pb90 Solder Powder / Tin Powder
Alloy Model
Sn10Pb90
Alloy Family
High-Lead Tin-Lead
Melting Point
302°C
Particle Size
Type 3 / 4 / 5
Low Alpha Option
Selected low alpha <0.01 cph/cm² or ultra-low alpha <0.002 cph/cm² options; confirm availability
Packaging
5 kg per bag; 4 bags per box; standard box size 18.5 × 18.5 × 18.5 cm
Typical Applications
High-Temperature Paste, Step Soldering, Die Attach, Power Electronics

Typical Applications

Final suitability should be confirmed against paste formulation, substrate finish, stencil design, deposition method, reflow profile and reliability requirements.

Application 01High-Temperature Paste
Application 02Step Soldering
Application 03Die Attach
Application 04Power Electronics
View the complete solder powder / tin powder series →

Need Sn10Pb90 solder powder for your formulation?

Contact Jufeng Solder for particle size confirmation, low alpha options, sample evaluation, packaging and quotation support.

Send an Inquiry

Want the product? Contact us!