Sn5Pb92.5Ag2.5 Solder Powder / Tin Powder
Sn5Pb92.5Ag2.5 Solder Powder / Tin Powder
A high-lead silver-bearing solder powder for high-temperature paste formulation, step soldering and specialty electronic packaging where permitted.
High-lead Sn-Pb-Ag powder for specialty high-temperature processes
This Sn-Pb-Ag alloy powder combines a high-lead composition with silver and is supplied in Type 3, Type 4 and Type 5 grades for controlled paste and deposition processes.
Selectable Particle Grades
Available in Type 3, 4, 5 for suitable printing, dispensing and paste formulation requirements.
Stable Alloy Composition
Controlled alloy composition supports consistent melting behavior and repeatable material formulation.
High-lead silver alloy
Provides a defined high-temperature composition for applications specifying silver-bearing high-lead solder.
Low Alpha Option
Selected low alpha or ultra-low alpha supply can be discussed; availability must be confirmed for the chosen alloy and particle grade.
Export Packaging
Standard supply is 5 kg per bag and 4 bags per box for practical storage and international shipment.
Custom Supply Support
Particle grade, alpha level, packaging and application requirements can be reviewed before quotation and sample evaluation.
Product Specifications
Core alloy, melting point, particle size and packaging information for engineering review and quotation.
Recommended Use
Recommended for permitted high-temperature solder paste, step soldering, die attach and specialty electronic packaging.
Typical Applications
Final suitability should be confirmed against paste formulation, substrate finish, stencil design, deposition method, reflow profile and reliability requirements.
Need Sn5Pb92.5Ag2.5 solder powder for your formulation?
Contact Jufeng Solder for particle size confirmation, low alpha options, sample evaluation, packaging and quotation support.
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