Sn99Ag0.5Cu0.5 Lead-Free Solder Wire
Sn99Ag0.5Cu0.5 Lead-Free Solder Wire
A low-silver Sn99Ag0.5Cu0.5 lead-free solder wire for electronic assembly, electrical connections and industrial soldering where alloy cost and joint performance must be balanced.
Low-silver SAC solder wire for practical lead-free assembly
Sn99Ag0.5Cu0.5 combines tin, a controlled silver addition and copper in a low-silver SAC composition. It is intended for applications that need lead-free process compatibility while controlling silver content and material cost.
Low-Silver SAC Alloy
Sn-Ag-Cu composition with 0.5% silver and 0.5% copper.
217–227°C Range
Lead-free melting range suitable for validated electronics processes.
Cost Control
Lower silver content helps balance alloy cost and joint requirements.
Electronic Soldering
Suitable for PCB, LED, electrical and selected industrial joints.
Flux-Cored Option
Built-in flux supports manual soldering and production feeding.
Custom Supply
Diameter, flux, spool weight, labeling and packaging can be discussed.
Product Specifications
Reference information for initial product selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.
Recommended Use
Recommended for PCB assembly, LED products, electronic repair, electrical components and selected industrial lead-free soldering where a low-silver SAC alloy is preferred.
Typical Applications
Application suitability depends on substrate finish, component design, flux selection, soldering equipment and reliability requirements.
Explore Lead-Free Solder Wire Options
Compare related alloys and wire configurations within the Jufeng lead-free solder wire series.
Technical information is provided for product selection reference. Validate the selected material using the actual components, substrates, equipment and reliability requirements.
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