Sn99Ag0.5Cu0.5 Lead-Free Solder Wire

Sn99Ag0.5Cu0.5
Sn99Ag0.5Cu0.5 lead-free solder wire is a tin-silver-copper solder alloy developed for reliable lead-free soldering in electronic assembly. With a melting point of approximately 227°C and available diameter from 0.25mm, it offers good solder flow, stable wetting, and consistent solder joint formation for PCB assembly, component soldering, and repair applications.
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Sn99Ag0.5Cu0.5
Lead-Free Solder Wire

Sn99Ag0.5Cu0.5 lead-free solder wire is a tin-silver-copper solder alloy developed for reliable lead-free soldering in electronic assembly. With a melting point of approximately 227°C and available diameter from 0.25mm, it offers good solder flow, stable wetting, and consistent solder joint formation for PCB assembly, component soldering, and repair applications.

Alloy
SnAgCu
Melting Point
227°C
Diameter
≥0.25mm
Compliance
Lead-Free

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Sn99Ag0.5Cu0.5 Lead-Free Solder Wire
Product Overview

A balanced SnAgCu solder wire for general electronics.

Sn99Ag0.5Cu0.5 solder wire is designed to provide stable soldering performance for lead-free production. Its tin-silver-copper alloy system offers good wettability, controlled flow, and reliable joint formation. It is suitable for electronic component soldering, PCB repair, and general assembly processes.

Balanced Alloy System

Tin, silver, and copper composition supports stable soldering and reliable joint formation.

Good Solder Flow

Provides smooth melting and spreading during soldering.

Reliable Joint Appearance

Helps form clean and consistent solder joints.

Process Flexibility

Available in flux-cored, no-clean, and solid-core options.

Technical Data

Sn99Ag0.5Cu0.5 solder wire specifications.

Core product parameters for quick evaluation and RFQ communication.

ItemSpecificationDescription
Product NameSn99Ag0.5Cu0.5 Lead-Free Solder WireSnAgCu lead-free solder wire
Alloy CompositionSn99 / Ag0.5 / Cu0.5Tin-silver-copper lead-free alloy
Melting Point227°CTypical melting point according to product catalog
Minimum Diameter≥0.25mmSuitable for general soldering and repair
Wire TypeFlux Cored / Solid Core OptionalCan be selected according to production needs
Flux TypeRosin Core / No-Clean OptionalCustom flux formulation available
SurfaceBright and smoothSupports consistent soldering and feeding
PackagingTube / Spool / Carton10g per tube; 100g–2000g per roll; carton packaging available
Applications

Suitable for common electronic assembly and repair.

Sn99Ag0.5Cu0.5 solder wire is suitable for lead-free soldering processes requiring good solderability and stable solder joint quality.

PCB Repair

Suitable for circuit board repair, component replacement, and maintenance.

Electronic Components

Used for soldering terminals, connectors, sensors, and small devices.

LED Products

Applicable to LED lighting modules and driver boards.

Manual Soldering

Suitable for soldering stations and general hand soldering processes.

Packaging

Flexible packaging for sampling and production.

Packaging can be selected according to wire diameter, order quantity, and shipping requirements.

Tube Packaging

10g per tube, suitable for samples, maintenance, and small-quantity use.

Spool Packaging

100g / 200g / 250g / 500g / 1000g / 2000g per roll available.

Carton Packaging

10 rolls per box; carton size can be arranged according to export shipment needs.

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