Sn95Sb5 Lead-Free Solder Wire
Sn95Sb5 Lead-Free Solder Wire
A tin-antimony lead-free solder wire for durable joints, elevated-temperature service and industrial electrical assembly.

Tin-antimony solder wire for stronger, heat-resistant joints
Sn95Sb5 combines tin with antimony to provide a higher melting point and improved joint strength compared with conventional low-temperature lead-free alloys. It is suitable for industrial soldering processes that prioritize thermal resistance and mechanical stability.
Higher Joint Strength
Antimony addition supports stronger solder joints for demanding assemblies.
Thermal Resistance
Approximately 240°C melting behavior suits selected elevated-temperature applications.
Stable Wire Feeding
Controlled wire diameter and a smooth surface support consistent manual or automated feeding.
Flux Options
Rosin-core, no-clean and selected custom flux systems can be discussed.
Lead-Free Alloy
Tin-antimony composition supports lead-free process requirements.
Flexible Packaging
Tube, spool and export carton options are available according to specification.
Product Specifications
Reference information for initial product selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.
Recommended Use
Recommended for industrial electronics, electrical terminals, power components, connectors and assemblies requiring stronger lead-free joints.
Typical Applications
Application suitability depends on substrate finish, component design, flux selection, soldering equipment and reliability requirements.
Explore Lead-Free Solder Wire Options
Compare related alloys and wire configurations within the Jufeng lead-free solder wire series.
Technical information is provided for product selection reference. Validate the selected material using the actual components, substrates, equipment and reliability requirements.
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