Sn42Bi58 Flux-Cored Lead-Free Solder Wire

Sn42Bi58 Flux-Cored
Sn42Bi58 flux-cored lead-free solder wire combines low-temperature tin-bismuth alloy performance with built-in flux for easier soldering operation. With a melting point of approximately 138°C and available diameter from 0.6mm, it is suitable for temperature-sensitive electronics, SMT rework, PCB repair, and low-thermal-stress soldering processes.
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Sn42Bi58 Flux-Cored Lead-Free Solder Wire

A 138°C Sn42Bi58 flux-cored lead-free solder wire for low-temperature electronics assembly, repair and heat-sensitive components.

Sn42Bi58Tin-Bismuth
Approximately 138°CMelting point
Flux-coredWire configuration
Sn42Bi58 Flux-Cored Lead-Free Solder Wire
Sn42Bi58 Flux-Cored Lead-Free Solder Wire

138°C flux-cored tin-bismuth wire for easy low-temperature soldering

Sn42Bi58 is a widely used low-temperature tin-bismuth alloy. In flux-cored wire form, it provides convenient solder and flux delivery for hand soldering, rework and secondary soldering processes.

01

138°C Melting Point

Low melting temperature reduces required process heat.

02

Built-In Flux Core

Integrated flux supports convenient manual soldering.

03

Reduced Thermal Exposure

Suitable for components, plastics and substrates sensitive to heat.

04

Step Soldering Support

Can be used in later assembly stages below higher-temperature joints.

05

Measured Solder Delivery

Wire format helps operators control deposited solder volume.

06

Packaging Options

Multiple spool weights and sample tube formats can be supplied.

Product Specifications

Reference information for initial product selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.

Recommended Use

Recommended for heat-sensitive electronics, step soldering, PCB repair, temperature-control components and low-temperature manual assembly.

Product Name
Sn42Bi58 Flux-Cored Lead-Free Solder Wire
Alloy / Series
Sn42Bi58
Alloy Family
Tin-Bismuth
Melting Point
Approximately 138°C
Wire Diameter
≥0.6 mm
Wire Type
Flux-cored
Flux Options
Rosin core / no-clean / custom option subject to selected specification
Packaging
10 g tube; 100 g / 200 g / 250 g / 500 g / 1000 g / 2000 g spool options subject to specification

Typical Applications

Application suitability depends on substrate finish, component design, flux selection, soldering equipment and reliability requirements.

Application 01Heat-Sensitive Electronics
Application 02Step Soldering
Application 03PCB Repair
Application 04Manual Assembly

Explore Lead-Free Solder Wire Options

Compare related alloys and wire configurations within the Jufeng lead-free solder wire series.

Technical information is provided for product selection reference. Validate the selected material using the actual components, substrates, equipment and reliability requirements.

Need a lead-free solder wire specification?

Send the required alloy, diameter, flux system, spool weight, application and annual demand for technical review and quotation.

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