Sn42Bi57Ag1 Flux-Cored Lead-Free Solder Wire

Sn42Bi57Ag1 Flux-Cored
Sn42Bi57Ag1 flux-cored lead-free solder wire is a low-temperature tin-bismuth-silver solder wire with built-in flux for convenient operation. With a melting point of approximately 138°C and available diameter from 0.6mm, it is suitable for electronic repair, SMT rework, low-temperature assembly, and applications where reduced thermal stress is required.
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Sn42Bi57Ag1 Flux-Cored Lead-Free Solder Wire

A low-temperature Sn42Bi57Ag1 flux-cored lead-free solder wire for controlled repair, heat-sensitive assembly and secondary soldering.

Sn42Bi57Ag1Tin-Bismuth-Silver
Approximately 139°CMelting point
Flux-coredWire configuration
Sn42Bi57Ag1 Flux-Cored Lead-Free Solder Wire
Sn42Bi57Ag1 Flux-Cored Lead-Free Solder Wire

139°C flux-cored Sn-Bi-Ag wire for reduced heat input

Sn42Bi57Ag1 flux-cored wire combines low-temperature alloy behavior with built-in flux for convenient operation. It is intended for applications where thermal exposure must be reduced and precise solder delivery is important.

01

139°C Joining

Low melting behavior supports reduced-temperature soldering.

02

Flux-Cored Convenience

Internal flux simplifies selected manual soldering processes.

03

Silver-Containing Alloy

Silver addition helps support stable solder joint performance.

04

Heat-Sensitive Use

Suitable for components and substrates that cannot tolerate SAC profiles.

05

Controlled Feeding

Wire form allows measured solder delivery during repair and prototyping.

06

Supply Flexibility

Diameter, flux specification and spool weight can be discussed.

Product Specifications

Reference information for initial product selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.

Recommended Use

Recommended for low-temperature PCB assembly, repair, step soldering, LED products, sensors and heat-sensitive electronic modules.

Product Name
Sn42Bi57Ag1 Flux-Cored Lead-Free Solder Wire
Alloy / Series
Sn42Bi57Ag1
Alloy Family
Tin-Bismuth-Silver
Melting Point
Approximately 139°C
Wire Diameter
≥0.6 mm
Wire Type
Flux-cored
Flux Options
Rosin core / no-clean / custom option subject to selected specification
Packaging
10 g tube; 100 g / 200 g / 250 g / 500 g / 1000 g / 2000 g spool options subject to specification

Typical Applications

Application suitability depends on substrate finish, component design, flux selection, soldering equipment and reliability requirements.

Application 01Low-Temperature PCB
Application 02LED & Sensors
Application 03Secondary Soldering
Application 04Precision Repair

Explore Lead-Free Solder Wire Options

Compare related alloys and wire configurations within the Jufeng lead-free solder wire series.

Technical information is provided for product selection reference. Validate the selected material using the actual components, substrates, equipment and reliability requirements.

Need a lead-free solder wire specification?

Send the required alloy, diameter, flux system, spool weight, application and annual demand for technical review and quotation.

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