Sn42Bi57Ag1 Solid Lead-Free Solder Wire

Sn42Bi57Ag1 Solid
Sn42Bi57Ag1 solid lead-free solder wire is a low-temperature tin-bismuth-silver solder alloy designed for reduced thermal stress and improved solder joint reliability. With a melting point of approximately 138°C and available diameter from 0.25mm, it is suitable for temperature-sensitive electronics, PCB repair, and controlled low-temperature soldering applications.
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Sn42Bi57Ag1 Solid Lead-Free Solder Wire

A solid-core Sn42Bi57Ag1 lead-free solder wire for low-temperature joining with separate control of flux chemistry and application.

Sn42Bi57Ag1Tin-Bismuth-Silver
Approximately 139°CMelting point
Solid coreWire configuration
Sn42Bi57Ag1 Solid Lead-Free Solder Wire
Sn42Bi57Ag1 Solid Lead-Free Solder Wire

Solid low-temperature Sn-Bi-Ag wire for controlled flux processes

The solid-core format allows engineers to select and apply external flux separately, which is useful for specialized substrates, controlled residue requirements and process development. The 139°C alloy helps limit thermal exposure.

01

Solid-Core Format

No internal flux allows independent flux selection and dosing.

02

139°C Melting

Low-temperature alloy behavior supports heat-sensitive joining.

03

Silver-Modified Alloy

Silver addition supports selected joint performance requirements.

04

Process Control

Suitable for engineering trials and processes with defined external flux.

05

Reduced Heat Input

Helps lower thermal stress compared with standard SAC soldering.

06

Custom Wire Supply

Diameter, spool size and packaging can be discussed for the target process.

Product Specifications

Reference information for initial product selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.

Recommended Use

Recommended for low-temperature assembly, external-flux processes, specialized substrates, step soldering and controlled production trials.

Product Name
Sn42Bi57Ag1 Solid Lead-Free Solder Wire
Alloy / Series
Sn42Bi57Ag1
Alloy Family
Tin-Bismuth-Silver
Melting Point
Approximately 139°C
Wire Diameter
≥0.6 mm
Wire Type
Solid core
Flux Options
Rosin core / no-clean / custom option subject to selected specification
Packaging
10 g tube; 100 g / 200 g / 250 g / 500 g / 1000 g / 2000 g spool options subject to specification

Typical Applications

Application suitability depends on substrate finish, component design, flux selection, soldering equipment and reliability requirements.

Application 01External-Flux Processes
Application 02Specialty Substrates
Application 03Step Soldering
Application 04Engineering Trials

Explore Lead-Free Solder Wire Options

Compare related alloys and wire configurations within the Jufeng lead-free solder wire series.

Technical information is provided for product selection reference. Validate the selected material using the actual components, substrates, equipment and reliability requirements.

Need a lead-free solder wire specification?

Send the required alloy, diameter, flux system, spool weight, application and annual demand for technical review and quotation.

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