Sn42Bi57.6Ag0.4 Flux-Cored Lead-Free Solder Wire

Sn42Bi57.6Ag0.4 Flux-Cored
Sn42Bi57.6Ag0.4 flux-cored lead-free solder wire is a low-temperature tin-bismuth-silver solder alloy designed for heat-sensitive electronic applications. With a melting point of approximately 138°C and available diameter from 0.6mm, it enables low-temperature soldering, reduced thermal stress, and convenient operation for repair, rework, and compact PCB assembly.
Quantity
Contact Now

Sn42Bi57.6Ag0.4

Flux-Cored
Lead-Free Solder Wire

Sn42Bi57.6Ag0.4 flux-cored lead-free solder wire is a low-temperature tin-bismuth-silver solder alloy designed for heat-sensitive electronic applications. With a melting point of approximately 138°C and available diameter from 0.6mm, it enables low-temperature soldering, reduced thermal stress, and convenient operation for repair, rework, and compact PCB assembly.

Alloy
SnBiAg
Melting Point
138°C
Diameter
≥0.6mm
Wire Type
Flux-Cored

Request Quote →Ask for Datasheet

Sn42Bi57.6Ag0.4 Flux-Cored Lead-Free Solder Wire
Product Overview

A low-temperature flux-cored solder wire with silver addition.

Sn42Bi57.6Ag0.4 solder wire is suitable for low-temperature soldering processes where heat-sensitive components and substrates require careful thermal control. Its flux-cored structure improves soldering convenience, while the silver-containing alloy helps support stable joint performance.

Low Thermal Stress

Low melting point helps reduce heat impact during soldering.

Flux-Cored Convenience

Built-in flux core supports easier manual soldering and repair.

Silver-Modified Alloy

Silver addition helps improve solder joint behavior and reliability.

Compact PCB Friendly

Suitable for small boards, delicate parts, and repair operations.

Technical Data

Sn42Bi57.6Ag0.4 Flux-Cored solder wire specifications.

Core product parameters for quick evaluation and RFQ communication.

ItemSpecificationDescription
Product NameSn42Bi57.6Ag0.4 Flux-Cored Lead-Free Solder WireLow-temperature SnBiAg solder wire
Alloy CompositionSn42 / Bi57.6 / Ag0.4Tin-bismuth-silver lead-free alloy
Melting Point138°CLow-temperature solder alloy
Minimum Diameter≥0.6mmSuitable for flux-cored solder wire production
Wire TypeFlux CoredBuilt-in flux for convenient soldering
Flux TypeRosin Core / No-Clean OptionalFlux formulation available on request
SurfaceBright and smoothSupports stable feeding and soldering
PackagingTube / Spool / Carton10g per tube; 100g–2000g per roll; carton packaging available
Applications

Designed for low-temperature soldering of sensitive electronics.

Sn42Bi57.6Ag0.4 flux-cored solder wire is suitable for applications requiring reduced thermal stress and convenient soldering operation.

Compact PCB Assembly

Suitable for small boards and dense components.

SMT Repair

Used for low-temperature rework and maintenance.

Sensitive Components

Helps reduce overheating risks during soldering.

Electronic Maintenance

Convenient for repair stations and manual soldering tasks.

Packaging

Flexible packaging for sampling and production.

Packaging can be selected according to wire diameter, order quantity, and shipping requirements.

Tube Packaging

10g per tube, suitable for samples, maintenance, and small-quantity use.

Spool Packaging

100g / 200g / 250g / 500g / 1000g / 2000g per roll available.

Carton Packaging

10 rolls per box; carton size can be arranged according to export shipment needs.

Want the product? Contact us!