Sn42Bi57.6Ag0.4 Flux-Cored Lead-Free Solder Wire

Sn42Bi57.6Ag0.4 Flux-Cored
Sn42Bi57.6Ag0.4 flux-cored lead-free solder wire is a low-temperature tin-bismuth-silver solder alloy designed for heat-sensitive electronic applications. With a melting point of approximately 138°C and available diameter from 0.6mm, it enables low-temperature soldering, reduced thermal stress, and convenient operation for repair, rework, and compact PCB assembly.
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Sn42Bi57.6Ag0.4 Flux-Cored Lead-Free Solder Wire

A 138°C tin-bismuth-silver flux-cored solder wire for heat-sensitive electronics, low-temperature repair and staged assembly.

Sn42Bi57.6Ag0.4Tin-Bismuth-Silver
Approximately 138°CMelting point
Flux-coredWire configuration
Sn42Bi57.6Ag0.4 Flux-Cored Lead-Free Solder Wire
Sn42Bi57.6Ag0.4 Flux-Cored Lead-Free Solder Wire

Low-temperature flux-cored solder wire with 0.4% silver

Sn42Bi57.6Ag0.4 combines a low melting point with a built-in flux core, helping reduce thermal exposure while simplifying manual soldering and rework. The silver-modified alloy is suited to compact electronics and controlled low-temperature joining.

01

138°C Low Melting

Lower processing temperature helps reduce heat input to sensitive components.

02

Built-In Flux

Flux-cored construction supports convenient hand soldering and repair.

03

Silver-Modified Alloy

A small silver addition supports stable joint behavior.

04

Reduced Thermal Stress

Useful where conventional SAC temperatures may be excessive.

05

Clean Operation

Suitable flux options can help limit spatter and post-solder residue.

06

Custom Packaging

Tube and spool formats can be arranged according to order requirements.

Product Specifications

Reference information for initial product selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.

Recommended Use

Recommended for compact PCB assembly, SMT repair, heat-sensitive components, staged soldering and electronic maintenance.

Product Name
Sn42Bi57.6Ag0.4 Flux-Cored Lead-Free Solder Wire
Alloy / Series
Sn42Bi57.6Ag0.4
Alloy Family
Tin-Bismuth-Silver
Melting Point
Approximately 138°C
Wire Diameter
≥0.6 mm
Wire Type
Flux-cored
Flux Options
Rosin core / no-clean / custom option subject to selected specification
Packaging
10 g tube; 100 g / 200 g / 250 g / 500 g / 1000 g / 2000 g spool options subject to specification

Typical Applications

Application suitability depends on substrate finish, component design, flux selection, soldering equipment and reliability requirements.

Application 01Compact PCB Assembly
Application 02SMT Rework
Application 03Sensitive Components
Application 04Step Soldering

Explore Lead-Free Solder Wire Options

Compare related alloys and wire configurations within the Jufeng lead-free solder wire series.

Technical information is provided for product selection reference. Validate the selected material using the actual components, substrates, equipment and reliability requirements.

Need a lead-free solder wire specification?

Send the required alloy, diameter, flux system, spool weight, application and annual demand for technical review and quotation.

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