Sn42Bi58 Solid Lead-Free Solder Wire

Sn42Bi58 Solid
Sn42Bi58 solid lead-free solder wire is a low-temperature tin-bismuth solder alloy with a melting point of approximately 138°C. It is designed for temperature-sensitive electronic components, PCB repair, and low-thermal-stress soldering applications. Available diameter starts from 0.25mm, making it suitable for controlled soldering where lower process temperature is required.
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Sn42Bi58 Solid Lead-Free Solder Wire

A solid-core Sn42Bi58 lead-free solder wire for 138°C joining processes that require separate external flux control.

Sn42Bi58Tin-Bismuth
Approximately 138°CMelting point
Solid coreWire configuration
Sn42Bi58 Solid Lead-Free Solder Wire
Sn42Bi58 Solid Lead-Free Solder Wire

Solid Sn42Bi58 wire for controlled low-temperature joining

Sn42Bi58 solid wire supplies the low-melting tin-bismuth alloy without an internal flux core. It is useful where external flux chemistry, quantity and cleaning requirements must be selected independently.

01

Solid-Core Control

External flux can be selected for the target surface and process.

02

138°C Alloy

Low melting point supports reduced-temperature joining.

03

Heat-Sensitive Applications

Helps limit thermal exposure to delicate components and substrates.

04

Secondary Soldering

Suitable for staged assembly below higher-temperature solder joints.

05

Smooth Wire Form

Controlled drawing supports handling and measured feeding.

06

Custom Supply

Diameter, spool weight, packaging and labeling can be discussed.

Product Specifications

Reference information for initial product selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.

Recommended Use

Recommended for external-flux processes, step soldering, heat-sensitive assembly, specialty joining and engineering evaluation.

Product Name
Sn42Bi58 Solid Lead-Free Solder Wire
Alloy / Series
Sn42Bi58
Alloy Family
Tin-Bismuth
Melting Point
Approximately 138°C
Wire Diameter
≥0.6 mm
Wire Type
Solid core
Flux Options
Rosin core / no-clean / custom option subject to selected specification
Packaging
10 g tube; 100 g / 200 g / 250 g / 500 g / 1000 g / 2000 g spool options subject to specification

Typical Applications

Application suitability depends on substrate finish, component design, flux selection, soldering equipment and reliability requirements.

Application 01External Flux Soldering
Application 02Secondary Assembly
Application 03Sensitive Substrates
Application 04Process Evaluation

Explore Lead-Free Solder Wire Options

Compare related alloys and wire configurations within the Jufeng lead-free solder wire series.

Technical information is provided for product selection reference. Validate the selected material using the actual components, substrates, equipment and reliability requirements.

Need a lead-free solder wire specification?

Send the required alloy, diameter, flux system, spool weight, application and annual demand for technical review and quotation.

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