Sn99Ag0.3Cu0.7 Lead-Free Solder Wire

Sn99Ag0.3Cu0.7
Sn99Ag0.3Cu0.7 lead-free solder wire is a low-silver tin-silver-copper alloy designed for cost-effective lead-free electronics assembly. With a melting point of approximately 217°C and available diameter from 0.25mm, it offers balanced solderability, stable wetting performance, and reliable solder joint formation for PCB assembly, repair, and general electronic manufacturing.
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Sn99Ag0.3Cu0.7 Lead-Free Solder Wire

A SAC0307 tin-silver-copper lead-free solder wire for electronics assembly, LED products, PCB soldering and industrial interconnection.

Sn99Ag0.3Cu0.7SAC0307 Tin-Silver-Copper
Approximately 217–227°CMelting point
Flux-cored / solid optionalWire configuration
Sn99Ag0.3Cu0.7 Lead-Free Solder Wire
Sn99Ag0.3Cu0.7 Lead-Free Solder Wire

SAC0307 solder wire for reliable lead-free electronic joints

Sn99Ag0.3Cu0.7 combines a low silver level with copper in a lead-free SAC alloy. It is used for electronics and electrical assembly where wetting, cost and joint performance must be balanced.

01

SAC0307 Alloy

Defined Sn-Ag-Cu composition for lead-free soldering.

02

Low Silver Content

Reduced silver level compared with SAC305 helps control material cost.

03

Electronic Soldering

Suitable for PCB, LED and selected precision electronic joints.

04

Flux-Cored Option

Built-in flux supports manual soldering and production feeding.

05

Fine Diameter Supply

Wire can be supplied in fine diameters subject to specification.

06

Custom Packaging

Sample tubes and multiple spool weights are available on request.

Product Specifications

Reference information for initial product selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.

Recommended Use

Recommended for PCB assembly, LED products, electronic repair, electrical components and selected industrial lead-free soldering.

Product Name
Sn99Ag0.3Cu0.7 Lead-Free Solder Wire
Alloy / Series
Sn99Ag0.3Cu0.7
Alloy Family
SAC0307 Tin-Silver-Copper
Melting Point
Approximately 217–227°C
Wire Diameter
≥0.15 mm
Wire Type
Flux-cored / solid optional
Flux Options
Rosin core / no-clean / custom option subject to selected specification
Packaging
10 g tube; 100 g / 200 g / 250 g / 500 g / 1000 g / 2000 g spool options subject to specification

Typical Applications

Application suitability depends on substrate finish, component design, flux selection, soldering equipment and reliability requirements.

Application 01PCB Assembly
Application 02LED Products
Application 03Electronic Repair
Application 04Industrial Electronics

Explore Lead-Free Solder Wire Options

Compare related alloys and wire configurations within the Jufeng lead-free solder wire series.

Technical information is provided for product selection reference. Validate the selected material using the actual components, substrates, equipment and reliability requirements.

Need a lead-free solder wire specification?

Send the required alloy, diameter, flux system, spool weight, application and annual demand for technical review and quotation.

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