Sn96.5Ag3.0Cu0.5 Lead-Free Solder Wire

Sn96.5Ag3.0Cu0.5、SAC305
Sn96.5Ag3.0Cu0.5 lead-free solder wire, also known as SAC305 solder wire, is widely used in electronic assembly where reliable solder joints, stable wetting performance, and RoHS-compliant lead-free production are required. With a melting point of approximately 217°C and available diameters from 0.1mm, it is suitable for precision soldering, SMT rework, PCB assembly, LED electronics, and fine electronic components.
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Sn96.5Ag3.0Cu0.5 Lead-Free Solder Wire

A SAC305 lead-free solder wire available from 0.1 mm for electronics assembly, precision repair, fine-pitch PCB work and general production.

Sn96.5Ag3.0Cu0.5SAC305 Tin-Silver-Copper
Approximately 217°CMelting point
Flux-cored / solid optionalWire configuration
Sn96.5Ag3.0Cu0.5 Lead-Free Solder Wire
Sn96.5Ag3.0Cu0.5 Lead-Free Solder Wire

SAC305 solder wire for precision and general electronics assembly

Sn96.5Ag3.0Cu0.5 is one of the most widely used lead-free solder alloys in electronics. It provides stable wetting and dependable joint performance, with ultra-fine diameter options for applications that require accurate solder-volume control.

01

SAC305 Alloy

Widely used tin-silver-copper composition for lead-free electronics.

02

0.1 mm Option

Ultra-fine diameter supports precise feeding on miniature solder joints.

03

Stable Wetting

Suitable flux systems support consistent spreading on solderable surfaces.

04

Reliable Joints

SAC305 is used in many modern electronic assembly and repair processes.

05

Low Spatter Options

Flux formulation can be selected for cleaner manual soldering.

06

Flexible Packaging

Tube, spool, OEM labeling and multiple weights are available.

Product Specifications

Reference information for initial product selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.

Recommended Use

Recommended for PCB assembly, fine-pitch repair, micro components, LED products, prototyping and general electronic soldering.

Product Name
Sn96.5Ag3.0Cu0.5 Lead-Free Solder Wire
Alloy / Series
Sn96.5Ag3.0Cu0.5
Alloy Family
SAC305 Tin-Silver-Copper
Melting Point
Approximately 217°C
Wire Diameter
From 0.1 mm
Wire Type
Flux-cored / solid optional
Flux Options
Rosin core / no-clean / custom option subject to selected specification
Packaging
10 g tube; 100 g / 200 g / 250 g / 500 g / 1000 g / 2000 g spool options subject to specification

Typical Applications

Application suitability depends on substrate finish, component design, flux selection, soldering equipment and reliability requirements.

Application 01PCB Assembly
Application 02Fine-Pitch Repair
Application 03Micro Components
Application 04LED & Electronics

Explore Lead-Free Solder Wire Options

Compare related alloys and wire configurations within the Jufeng lead-free solder wire series.

Technical information is provided for product selection reference. Validate the selected material using the actual components, substrates, equipment and reliability requirements.

Need a lead-free solder wire specification?

Send the required alloy, diameter, flux system, spool weight, application and annual demand for technical review and quotation.

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