Sn96.5Ag3.0Cu0.5 Lead-Free Solder Wire

Sn96.5Ag3.0Cu0.5、SAC305
Sn96.5Ag3.0Cu0.5 lead-free solder wire, also known as SAC305 solder wire, is widely used in electronic assembly where reliable solder joints, stable wetting performance, and RoHS-compliant lead-free production are required. With a melting point of approximately 217°C and available diameters from 0.1mm, it is suitable for precision soldering, SMT rework, PCB assembly, LED electronics, and fine electronic components.
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Sn96.5Ag3.0Cu0.5
Lead-Free Solder Wire

Sn96.5Ag3.0Cu0.5 lead-free solder wire, also known as SAC305 solder wire, is widely used in electronic assembly where reliable solder joints, stable wetting performance, and RoHS-compliant lead-free production are required. With a melting point of approximately 217°C and available diameters from 0.1mm, it is suitable for precision soldering, SMT rework, PCB assembly, LED electronics, and fine electronic components.

Alloy
SAC305
Melting Point
217°C
Diameter
≥0.1mm
Compliance
Lead-Free

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Sn96.5Ag3.0Cu0.5 Lead-Free Solder Wire
Product Overview

A reliable SAC305 solder wire for precision electronics.

SAC305 is one of the most commonly used lead-free solder alloy systems in modern electronics manufacturing. The combination of tin, silver, and copper provides good wetting behavior, mechanical strength, thermal fatigue resistance, and stable solder joint performance. This solder wire is suitable for both hand soldering and automatic soldering processes, especially where fine wire diameter and consistent feeding are required.

Fine Diameter Available

Available from 0.1mm, suitable for compact PCB layouts and precision component soldering.

Stable Wetting

Designed for smooth spreading, fast soldering response, and clean solder joint formation.

Lead-Free Reliability

Suitable for RoHS-oriented production and long-term electronic reliability requirements.

Consistent Feeding

Uniform wire diameter supports manual soldering, repair stations, and automated solder feeding systems.

Technical Data

Sn96.5Ag3.0Cu0.5 solder wire specifications.

Core product parameters for quick evaluation and RFQ communication.

ItemSpecificationDescription
Product NameSn96.5Ag3.0Cu0.5 Lead-Free Solder WireSAC305 solder wire for electronics assembly
Alloy CompositionSn96.5 / Ag3.0 / Cu0.5Tin-silver-copper lead-free alloy
Melting Point217°CTypical melting point for SAC305 alloy
Minimum Diameter≥0.1mmFine diameter available for precision soldering
Wire TypeFlux Cored / Solid Core OptionalCan be selected according to production process
Flux TypeRosin Core / No-Clean OptionalCustom flux formulation available on request
SurfaceBright and smoothSupports stable feeding and clean soldering
PackagingTube / Spool / Carton10g per tube; 100g–2000g per roll; carton packaging available
Applications

Designed for fine electronics soldering.

SAC305 solder wire is suitable for common lead-free soldering processes where stable wetting, good mechanical reliability, and consistent wire feeding are required.

PCB Assembly

Used for PCB component soldering, circuit repair, through-hole soldering, and lead-free assembly.

SMT Rework

Fine wire diameter supports local repair and rework of compact electronic components.

LED Electronics

Suitable for LED strips, LED modules, driver boards, and lighting electronics.

Precision Components

Useful for soldering compact boards, connectors, terminals, sensors, and small electronic devices.

Packaging

Flexible packaging for sampling and production.

Packaging can be selected according to wire diameter, order quantity, and shipping requirements.

Tube Packaging

10g per tube, suitable for samples, maintenance, and small-quantity use.

Spool Packaging

100g / 200g / 250g / 500g / 1000g / 2000g per roll available.

Carton Packaging

10 rolls per box; carton size can be arranged according to export shipment needs.

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