Sn97Cu3 Lead-Free Solder Wire
Sn97Cu3 Lead-Free Solder Wire
A high-copper Sn97Cu3 lead-free solder wire for copper and copper-alloy components, industrial metal joining and elevated-temperature soldering processes.
High-copper tin-copper solder wire for industrial joining
Sn97Cu3 is a silver-free tin-copper alloy with a broad melting range and higher copper content than common Sn99.3Cu0.7 wire. It is intended for specialized industrial soldering and copper-based joints where the process temperature and substrate compatibility have been validated.
High-Copper Sn-Cu
Tin-copper composition containing approximately 3% copper.
Broad Melting Range
Process setup must account for an approximately 227–310°C melting range.
Silver-Free Alloy
Avoids silver content for applications that specify an Sn-Cu composition.
Copper-Based Joints
Applicable to selected copper and copper-alloy components.
Industrial Processes
Suitable for specialized joining after temperature and wetting validation.
Custom Supply
Diameter, wire type, flux system and packaging can be discussed.
Product Specifications
Reference information for initial product selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.
Recommended Use
Recommended for copper and copper-alloy components, industrial metal joining, specialty electrical work and elevated-temperature processes after full solderability and reliability validation.
Typical Applications
Application suitability depends on substrate finish, component design, flux selection, soldering equipment and reliability requirements.
Explore Lead-Free Solder Wire Options
Compare related alloys and wire configurations within the Jufeng lead-free solder wire series.
Technical information is provided for product selection reference. Validate the selected material using the actual components, substrates, equipment and reliability requirements.
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