Sn96.5Ag3.5 Lead-Free Solder Wire

Sn96.5Ag3.5
Sn96.5Ag3.5 lead-free solder wire is a tin-silver alloy solder wire designed for reliable electronic assembly and lead-free soldering processes. With a melting point of approximately 222°C and available diameter from 0.8mm, it provides stable soldering performance, good mechanical strength, and clean solder joint formation for PCB assembly, repair, and general electronics manufacturing.
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Sn96.5Ag3.5 Lead-Free Solder Wire

A eutectic Sn96.5Ag3.5 tin-silver lead-free solder wire with a 221°C melting point for electronics, precision soldering and industrial joining.

Sn96.5Ag3.5Eutectic Tin-Silver
Approximately 221°CMelting point
Flux-cored / solid optionalWire configuration
Sn96.5Ag3.5 Lead-Free Solder Wire
Sn96.5Ag3.5 Lead-Free Solder Wire

Eutectic tin-silver solder wire for consistent lead-free joining

Sn96.5Ag3.5 is a binary tin-silver lead-free solder alloy with a single eutectic melting point around 221°C. Its defined melting behavior and silver-bearing composition make it suitable for selected electronic, electrical and industrial soldering processes after application validation.

01

Eutectic Sn-Ag Alloy

Binary tin-silver composition with a defined 221°C melting point.

02

221°C Melting

Single-point melting behavior supports controlled process setup.

03

Silver-Bearing Joints

Silver addition supports selected mechanical and thermal performance needs.

04

Electronics Use

Suitable for PCB, electrical and precision soldering after process confirmation.

05

Flux Options

No-clean, rosin-core and selected custom flux systems are available.

06

Flexible Packaging

Tube, spool, OEM labeling and multiple weights can be supplied.

Product Specifications

Reference information for initial product selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.

Recommended Use

Recommended for electronic assembly, precision soldering, electrical components, specialty joining, repair and industrial applications requiring a tin-silver alloy.

Product Name
Sn96.5Ag3.5 Lead-Free Solder Wire
Alloy / Series
Sn96.5Ag3.5
Alloy Family
Tin-Silver
Melting Point
Approximately 221°C
Wire Diameter
≥0.2 mm
Wire Type
Flux-cored / solid optional
Flux Options
Rosin core / no-clean / custom option subject to selected specification
Packaging
10 g tube; 100 g / 200 g / 250 g / 500 g / 1000 g / 2000 g spool options subject to specification

Typical Applications

Application suitability depends on substrate finish, component design, flux selection, soldering equipment and reliability requirements.

Application 01Electronic Assembly
Application 02Precision Soldering
Application 03Electrical Components
Application 04Specialty Joining

Explore Lead-Free Solder Wire Options

Compare related alloys and wire configurations within the Jufeng lead-free solder wire series.

Technical information is provided for product selection reference. Validate the selected material using the actual components, substrates, equipment and reliability requirements.

Need a lead-free solder wire specification?

Send the required alloy, diameter, flux system, spool weight, application and annual demand for technical review and quotation.

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