Sn96.5Ag3.5 Lead-Free Solder Wire

Sn96.5Ag3.5
Sn96.5Ag3.5 lead-free solder wire is a tin-silver alloy solder wire designed for reliable electronic assembly and lead-free soldering processes. With a melting point of approximately 222°C and available diameter from 0.8mm, it provides stable soldering performance, good mechanical strength, and clean solder joint formation for PCB assembly, repair, and general electronics manufacturing.
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Sn96.5Ag3.5
Lead-Free Solder Wire

Sn96.5Ag3.5 lead-free solder wire is a tin-silver alloy solder wire designed for reliable electronic assembly and lead-free soldering processes. With a melting point of approximately 222°C and available diameter from 0.8mm, it provides stable soldering performance, good mechanical strength, and clean solder joint formation for PCB assembly, repair, and general electronics manufacturing.

Alloy
SnAg
Melting Point
222°C
Diameter
≥0.8mm
Compliance
Lead-Free

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Sn96.5Ag3.5 Lead-Free Solder Wire
Product Overview

A tin-silver solder wire for stable lead-free assembly.

Sn96.5Ag3.5 solder wire is suitable for electronic applications requiring good wetting, stable alloy composition, and reliable lead-free solder joints. Compared with common tin-copper solder wire, its silver-containing alloy system helps improve joint strength and soldering stability. It is suitable for manual soldering, repair work, and general electronic assembly.

Silver-Containing Alloy

Tin-silver composition supports stable solder joint formation and reliable mechanical performance.

Good Solderability

Provides smooth solder flow and clean wetting on suitable metal surfaces.

Stable Joint Strength

Suitable for electronic products requiring consistent connection reliability.

Flexible Process Use

Can be supplied as flux-cored or solid-core wire according to soldering requirements.

Technical Data

Sn96.5Ag3.5 solder wire specifications.

Core product parameters for quick evaluation and RFQ communication.

ItemSpecificationDescription
Product NameSn96.5Ag3.5 Lead-Free Solder WireTin-silver lead-free solder wire
Alloy CompositionSn96.5 / Ag3.5Tin-silver lead-free alloy
Melting Point222°CTypical melting point for SnAg alloy
Minimum Diameter≥0.8mmStandard diameter range for general soldering
Wire TypeFlux Cored / Solid Core OptionalAvailable according to process needs
Flux TypeRosin Core / No-Clean OptionalFlux formulation can be customized
SurfaceBright and smoothSupports stable wire feeding and soldering
PackagingTube / Spool / Carton10g per tube; 100g–2000g per roll; carton packaging available
Applications

Suitable for general lead-free electronic soldering.

Sn96.5Ag3.5 solder wire is commonly used where tin-silver lead-free soldering performance and stable joint formation are required.

PCB Assembly

Used for general PCB soldering and electronic component attachment.

Repair & Maintenance

Suitable for soldering stations, repair work, and small-batch production.

LED Electronics

Can be used for lighting modules, LED strips, and driver boards.

Industrial Electronics

Suitable for electronic products requiring reliable lead-free solder connections.

Packaging

Flexible packaging for sampling and production.

Packaging can be selected according to wire diameter, order quantity, and shipping requirements.

Tube Packaging

10g per tube, suitable for samples, maintenance, and small-quantity use.

Spool Packaging

100g / 200g / 250g / 500g / 1000g / 2000g per roll available.

Carton Packaging

10 rolls per box; carton size can be arranged according to export shipment needs.

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