Incomplete filling, cracks and unstable electrical resistance can turn a small via into a costly production problem. For manufacturers working on TGV and HDI designs, the goal is clear: fill the vias consistently and keep the connections stable through processing and use.

Jufeng JL-CS-F01 copper via filling paste is a single-component conductive resin material developed for via plugging and filling. It combines stable electrical conductivity, strong adhesion and crack resistance, with dispensing and printing compatibility for process development.

How JL-CS-F01 Addresses Via Filling Challenges

Incomplete Filling and Trapped Air

Small holes can be difficult to fill evenly. Trapped air or incomplete filling can interrupt the intended conductive path and create extra inspection and rework.

CS-F01 supports dispensing and printing, allowing the application method to be matched to the via design. Its formulation has 100% solid content. Combining suitable filling settings with well-prepared via surfaces helps control trapped air and improve filling consistency.

Cracking and Poor Adhesion

A filled via needs to stay bonded during curing and later temperature changes. Cracks or separation at the interface can compromise the connection.

CS-F01 is formulated for strong adhesion, crack resistance and low thermal expansion. These properties support the integrity of the cured filling. For glass substrates in particular, compatibility between the paste, surface treatment and substrate should be verified in the actual assembly.

Electrical Resistance That Does Not Meet Requirements

A filled hole must provide the electrical performance the design requires.

The CS-F01 TDS lists volume resistivity below 8 × 10⁻⁵ Ω·cm. This provides a measurable reference when selecting a conductive via filling material. Finished-via resistance also depends on via dimensions, interfaces and curing quality.

Complicated Material Preparation

Additional mixing steps can make process preparation more demanding.

As a single-component paste, CS-F01 requires no two-part mixing. The TDS specifies curing at 180°C for 60 minutes in nitrogen, giving manufacturers a clear reference condition for evaluation.

Copper Paste for TGV Filling

Through-glass vias (TGVs) create electrical connections through glass substrates used in advanced packaging.

For TGV filling projects, the main concerns include getting material into the holes, maintaining adhesion and managing stress during temperature changes. CS-F01 offers a conductive paste option for evaluation where its filling method and curing conditions fit the glass substrate and interconnect design.

Share your glass type, hole diameter, depth and surface treatment with Jufeng to discuss a suitable evaluation approach.

Conductive Via Filling for HDI PCBs

High-density interconnect (HDI) PCBs use small vias and fine circuit features to fit more connections into a compact board.

For HDI designs that specify conductive paste filling, CS-F01 offers stable conductivity, adhesion and crack resistance in a formulation compatible with dispensing and printing.

Material selection should match the board construction, via geometry and electrical requirements of the finished product.

Frequently Asked Questions

How Do You Choose a Copper Paste for Via Filling?

Start with the via diameter and depth, substrate type and curing limits. Then compare application compatibility, cured resistivity, adhesion and thermal behavior. Confirm the choice with trials on the actual substrate and via design.

How Is Copper Paste Filling Different from Copper Electroplating?

Copper paste filling applies and cures a conductive material inside the via. Electroplating deposits metallic copper. The choice depends on the board or package design, electrical requirements and manufacturing process.

Find the Right Via Filling Material for Your Project

If you are looking for a copper via filling paste for TGV or HDI applications, start with the requirements of your design.

Send Jufeng your substrate material, via dimensions, application method and curing limits. Our team can discuss CS-F01 suitability and help you move forward with material evaluation.

Explore JL-CS-F01 Copper Via Filling Paste and contact us for the technical data sheet, samples and application support.