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    Home /Applications /Exhibition News /Kickoff Success for the New Year! Jufeng Shines at NEPCON JAPAN /

    Kickoff Success for the New Year! Jufeng Shines at NEPCON JAPAN

    2026-05-27

    As the new year unfolds with fresh possibilities, Jufeng begins its 2026 international journey with strong momentum. The first stop was NEPCON JAPAN 2026, where Jufeng presented the strength and innovation of Chinese brands to the global electronics manufacturing industry.

    From January 21 to 23, 2026, the three-day NEPCON JAPAN 2026 successfully concluded. As the 40th NEPCON JAPAN, the Electronic R&D, Manufacturing and Packaging Technology Exhibition brought together electronics manufacturing professionals, industry peers and buyers from around the world.

    Recognized as a key professional event for electronics manufacturing in Japan and across Asia, this year’s exhibition provided an efficient platform for business matching, technical exchange and global industry communication.

    Jufeng at NEPCON JAPAN 2026

    A Strong Opening Exhibition for 2026

    As Jufeng’s first major international exhibition of the year, the team made careful preparations and presented a powerful lineup of core products to global visitors.

    Maxilver® Sintered Silver Series
    CuTenix® Fully Sintered Copper Series
    Maxilver® Conductive Silver Paste Series
    CuTenix® Conductive Copper Paste Series

    Thanks to outstanding product stability and comprehensive performance, Jufeng’s booth attracted a steady stream of visitors throughout the exhibition. Many attendees stopped to observe the product displays, discuss technical details and explore potential cooperation opportunities.

    With strong product presentation and professional communication, Jufeng became one of the highlights at the event, demonstrating the growing competitiveness of Chinese advanced electronic material brands in the international market.

    Jufeng Product Display at NEPCON JAPAN 2026

    Professional Technical Exchange with Global Customers

    During the exhibition, Jufeng’s technical team received customers from across the globe with professional expertise and enthusiastic service. In addition to introducing the core advantages and application scenarios of each product series, the team provided precise answers to various technical questions raised by visitors.

    Their solid technical capabilities earned strong recognition from customers. Initial cooperation intentions were successfully reached with several high-quality potential clients, further proving Jufeng’s strength in the field of semiconductor packaging materials.

    Strengthening Jufeng’s Presence in High-End Electronics Manufacturing

    This exhibition fully demonstrated Jufeng’s core competitiveness as a specialized, refined, distinctive and innovative enterprise in semiconductor packaging materials. It also laid a solid foundation for Jufeng’s further expansion into the Japanese and global high-end electronics manufacturing markets.

    Looking Ahead to 2026

    In 2026, Jufeng will continue to build on this successful start, increase investment in research and development, and focus on core fields such as semiconductor packaging and automotive electronics.

    The company will continue to iterate and upgrade innovative products that meet international market demands, providing advanced semiconductor packaging material solutions for the high-quality development of the global electronics industry.

    NEPCON JAPAN 2026 marked a strong beginning for Jufeng’s international journey this year. Moving forward, Jufeng will continue to connect with global customers, explore new opportunities, and contribute reliable material solutions to the electronics manufacturing industry.

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