This Type of SiC Packaging Material Is Expected to Grow 700%, and Domestic Manufacturers Are Already Taking the Lead

With the rapid development of new energy vehicles, 5G communication and other high-power electronics industries, the requirements for electronic packaging technologies and materials are increasing, especially in high power, high temperature and long-term stability applications.

Traditional gold-tin solder has long been widely used in optoelectronic packaging and high-reliability military electronic device soldering due to its strong performance. However, with growing application demand, gold-tin solder also faces several challenges.

As a new-generation chip interconnection material, sintered silver offers bonding reliability 10 times higher than solder alloys. Over the years, chip attach materials have been shifting from traditional solder alloys toward sintered silver.

According to Mitsui Mining & Smelting, the market size of sintering materials is expected to reach around 80 billion yen, approximately RMB 3.651 billion, by 2035. This is about seven times the current scale.

Jufeng Sintered Silver Demonstrates Strong Performance

Jufeng is one of the domestic manufacturers that has achieved localization of sintered silver paste. With strong expertise in the field, Jufeng’s products demonstrate excellent processing performance and combine high performance with cost competitiveness.

Compared with traditional gold-tin solder, Jufeng sintered silver shows five major advantages.

1. Higher Shear Strength

Jufeng sintered silver delivers stronger mechanical performance and is suitable for higher-strength application scenarios.

2. Lower Processing Temperature

Jufeng sintered silver can be processed at 230℃-260℃, while gold-tin solder usually requires a processing temperature above 300℃.

This lower processing temperature makes sintered silver suitable for more low-temperature processes and expands its application range.

3. Higher Service Temperature

Jufeng sintered silver has a melting point of up to 961℃, while the maximum service temperature of gold-tin solder is around 280℃.

This gives sintered silver stronger performance in high-temperature operating environments.

4. Higher Thermal Conductivity

Jufeng sintered silver offers thermal conductivity above 200 W/mK, while gold-tin solder has thermal conductivity of only around 60 W/mK.

The high thermal conductivity of sintered silver helps dissipate heat more effectively and improve the reliability of electronic devices.

5. Stronger Interface Compatibility

Sintered silver can be compatible with multiple interfaces, including gold, silver, copper, nickel, stainless steel, aluminum alloy and glass.

By comparison, the melting point of gold-tin solder near the eutectic temperature is highly sensitive to composition. When the weight ratio of gold exceeds 80%, the melting point rises sharply.

Sintered silver avoids the melting point increase caused by gold diffusion from the gold-plated layer, providing more stable process compatibility.