Sn99.3Cu0.7 solder bar
Sn99.3Cu0.7 Solder Bar
Sn99.3Cu0.7 is a lead-free tin-copper solder bar for wave soldering, dip soldering, tinning and general electronics manufacturing where a silver-free alloy is preferred.
Cost-effective tin-copper solder bar for wave soldering
The Sn-Cu composition offers a practical alternative to silver-containing SAC alloys. Process validation should consider its higher operating temperature, copper dissolution behavior, flux selection and solder-bath maintenance.
Silver-Free Alloy
Tin-copper chemistry helps control raw-material cost compared with silver-bearing alloys.
227°C Melting Point
Suitable for lead-free processes designed for Sn-Cu operating temperatures.
Wave Soldering Supply
Bar form supports solder-pot filling, replenishment and alloy maintenance.
Stable Production Control
Controlled composition helps support repeatable bath performance.
Practical Tinning Performance
Suitable for compatible terminals, leads and metal surfaces with the correct flux.
Custom Supply Review
Packaging, impurity limits and documentation can be reviewed for production orders.
Recommended Use
Recommended for suitable wave soldering, dip soldering, terminal tinning and solder-pot processes where Sn99.3Cu0.7 is specified.
Product Specifications
Core data for initial product selection. Final alloy tolerance, bar size and packaging should be confirmed against the approved specification or purchase order.
Typical Applications
Application suitability depends on the substrate finish, flux, solder-bath condition, temperature profile, joint design and reliability requirements.
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