Sn95Sb5 solder bar

Sn95Sb5 solder bar
Tin-antimony solder bar with stable melting behavior for selected industrial and electronic soldering processes. Supplied in standard bar dimensions with export carton packaging for industrial soldering production.
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Sn95Sb5 Solder Bar

Sn95Sb5 solder bar is a lead-free tin-antimony alloy for selected electronic and industrial soldering processes requiring higher strength and elevated-temperature capability compared with pure-tin systems.

Sn95Sb5Lead-free alloy
240°CMelting point
Bar SupplyWave, dip and tinning processes
Sn95Sb5 Solder Bar
Sn95Sb5 Solder Bar

Tin-antimony solder bar for stronger industrial joints

The antimony addition improves alloy hardness and strength. Final suitability depends on substrate, joint design, flux, thermal profile and service-temperature requirements.

01

Tin-Antimony System

Antimony addition supports improved strength and hardness.

02

240°C Melting Point

Suitable for selected processes requiring a higher operating temperature.

03

Lead-Free Composition

Provides a lead-free option for specialized industrial soldering.

04

Stable Bar Supply

Bar form supports controlled melting and production handling.

05

Process Flexibility

Applicable to compatible dip, tinning and industrial joining processes.

06

Technical Review Support

Jufeng can review alloy, flux, packaging and application requirements.

Recommended Use

Recommended for industrial soldering, electrical components, terminal joining, tinning and selected high-temperature applications where Sn95Sb5 is specified.

Product Specifications

Core data for initial product selection. Final alloy tolerance, bar size and packaging should be confirmed against the approved specification or purchase order.

Product Name
Sn95Sb5 Solder Bar
Alloy Model
Sn95Sb5
Alloy System
Sn-Sb
Melting Point
240°C
Standard Bar Dimension
34.5 × 1.5/2.0 × 1.6 cm
Typical Packaging
Approx. 700g per bar; 20kg/carton, subject to confirmed specification
Supply Form
Solder bar; other forms subject to alloy and order review
Customization
Alloy tolerance, impurity limits, dimensions and packaging available upon request

Typical Applications

Application suitability depends on the substrate finish, flux, solder-bath condition, temperature profile, joint design and reliability requirements.

Application 01Industrial Soldering
Application 02Electrical Components
Application 03Terminal Joining
Application 04Higher-Temperature Use

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