Sn96.5Ag3.0Cu0.5 solder bar
Sn96.5Ag3.0Cu0.5 Solder Bar
Sn96.5Ag3.0Cu0.5 solder bar, commonly known as SAC305, is designed for lead-free wave soldering, dip soldering and electronic assembly where consistent alloy control and dependable joint performance are required.
SAC305 solder bar for stable lead-free production
The balanced tin-silver-copper composition is widely used in lead-free electronics manufacturing. It supports reliable wetting and mechanical performance when matched with the correct flux, bath temperature and process controls.
Widely Used SAC305 Alloy
A recognized lead-free alloy for electronics manufacturing and assembly.
Stable 217°C Melting Point
Defined melting behavior supports controlled production profiles.
Reliable Joint Performance
Tin-silver-copper chemistry supports dependable mechanical and thermal cycling behavior.
Good Process Compatibility
Suitable for wave, dip and tinning processes after flux and profile validation.
Consistent Alloy Control
Composition monitoring helps maintain stable solder-bath performance.
Production Supply Support
Standard bars, packaging and batch documentation can be confirmed before order.
Recommended Use
Recommended for wave soldering, dip soldering, solder-pot replenishment, component tinning and general electronics assembly using SAC305.
Product Specifications
Core data for initial product selection. Final alloy tolerance, bar size and packaging should be confirmed against the approved specification or purchase order.
Typical Applications
Application suitability depends on the substrate finish, flux, solder-bath condition, temperature profile, joint design and reliability requirements.
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