Sn96.5Ag3.0Cu0.5 solder bar
Sn96.5Ag3.0Cu0.5 solder bar
Lead-free SAC305 solder bar for stable wave soldering, dip soldering, and electronic assembly processes. Supplied in standard bar dimensions with export carton packaging for industrial soldering production.
Lead-free solder bar for stable soldering production.
Sn96.5Ag3.0Cu0.5 solder bar is designed for customers who require consistent alloy composition, stable melting behavior, and practical packing for industrial soldering use. It can be used in suitable wave soldering, dip soldering, tinning, and general electronic assembly processes depending on process requirements.
Stable Alloy Composition
Designed for consistent soldering behavior and reliable production control.
Lead-Free Supply
Suitable for lead-free soldering requirements in electronics manufacturing.
Standard Bar Size
Standard dimension: 34.5 × 1.5/2.0 × 1.6 cm, convenient for production handling.
Export Packaging
Approx. 700g per bar; 20kg per carton; box size 38 × 16.5 × 10 cm.
Core specifications
| Product Name | Sn96.5Ag3.0Cu0.5 solder bar |
| Alloy System | Sn-Ag-Cu |
| Melting Point | 217°C |
| Dimension | 34.5 × 1.5/2.0 × 1.6 cm |
| Packaging | Approx. 700g per bar; 20kg per carton; box size 38 × 16.5 × 10 cm |
For lead-free soldering production.
Want the product? Contact us!