Sn96.5Ag3.5 solder bar
Sn96.5Ag3.5 Solder Bar
Sn96.5Ag3.5 solder bar is a lead-free tin-silver alloy for electronic and industrial soldering processes that require stable melting behavior and silver-containing joint performance.
Tin-silver lead-free solder bar for reliable joining
The binary Sn-Ag composition melts at approximately 222°C and can be selected for applications where copper-free tin-silver chemistry is preferred. Flux, bath materials and process temperature should be validated for the intended assembly.
Tin-Silver Composition
Copper-free Sn-Ag chemistry for specified joining processes.
222°C Melting Point
Defined melting behavior for controlled lead-free production.
Silver-Containing Alloy
Supports reliable joint performance in suitable applications.
Lead-Free Supply
Applicable to projects requiring a lead-free solder composition.
Standard Bar Format
Suitable for production handling and solder-pot charging.
Batch Documentation
Composition and supply documents can be confirmed for qualified orders.
Recommended Use
Recommended for selected electronics assembly, dip soldering, component tinning and industrial joining where Sn96.5Ag3.5 is specified.
Product Specifications
Core data for initial product selection. Final alloy tolerance, bar size and packaging should be confirmed against the approved specification or purchase order.
Typical Applications
Application suitability depends on the substrate finish, flux, solder-bath condition, temperature profile, joint design and reliability requirements.
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