Sn42Bi58 solder bar
Sn42Bi58 Solder Bar
Sn42Bi58 solder bar is a low-temperature lead-free alloy for temperature-sensitive assemblies, staged soldering and applications requiring reduced thermal stress.
138°C low-temperature tin-bismuth solder bar
The eutectic-like Sn-Bi composition provides a low 138°C melting point. It should be evaluated carefully for joint design, mechanical loading and operating-temperature requirements because bismuth-rich alloys can be less ductile than conventional SAC solders.
138°C Melting Point
Enables substantially lower soldering temperatures than common SAC alloys.
Reduced Heat Input
Helps limit thermal exposure during assembly.
Lead-Free Alloy
Tin-bismuth chemistry supports lead-free low-temperature applications.
Sharp Melting Behavior
Defined phase transition supports controlled heating and cooling.
Standard Bar Supply
Convenient for alloy charging, melting and production handling.
Reliability Review Required
Mechanical loading and service temperature should be assessed for each application.
Recommended Use
Recommended for low-temperature joining, heat-sensitive components, staged assembly and selected repair or industrial applications where Sn42Bi58 is specified.
Product Specifications
Core data for initial product selection. Final alloy tolerance, bar size and packaging should be confirmed against the approved specification or purchase order.
Typical Applications
Application suitability depends on the substrate finish, flux, solder-bath condition, temperature profile, joint design and reliability requirements.
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