Lead-Free Solder Bar / Solder Ball / Tin Anode

A complete lead-free solder material series for wave soldering, dip soldering, electronic assembly, alloy replenishment, and related industrial soldering processes. Multiple alloy systems are available to match different melting points and process requirements.

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Lead-Free Solder Materials Series

Lead-Free Solder Bar / Solder Ball / Tin Anode

A complete lead-free solder material series for wave soldering, dip soldering, electronic assembly, alloy replenishment, and related industrial soldering processes. Multiple alloy systems are available to match different melting points and process requirements.

Multiple lead-free alloy options

Stable melting point control

Standard solder bar dimensions

Carton packaging for export supply

Product Series

Solder Bar / Ball / Tin Anode

Melting Range

138°C to 300°C

Bar Dimension

34.5 × 1.5/2.0 × 1.6 cm

Packaging

Approx. 700g/bar · 20kg/ctn

Product Overview

Lead-free solder bars for stable soldering performance.

Lead-free solder bars are supplied in multiple alloy compositions for different electronic assembly and soldering processes. The series covers SAC alloys, Sn-Cu alloys, Sn-Bi low-temperature alloys, and Sn-Sb high-temperature alloy options. Standard bar dimensions and export carton packaging support stable production supply.

01

Multiple Alloy Choices

Includes SAC, Sn-Cu, Sn-Bi, and Sn-Sb alloy systems for different process windows.

02

Stable Melting Point

Clear alloy melting points help match soldering temperature and production requirements.

03

Standard Bar Size

Standard solder bar dimension: 34.5 × 1.5/2.0 × 1.6 cm.

04

Export Packaging

Approx. 700g per bar, 20kg per carton, carton size 38 × 16.5 × 10 cm.

Product Library

Available solder bar models

Each solder alloy is displayed as a separate product-style item. The image URL is temporarily reused and can be replaced later with the corresponding solder bar, solder ball, tin anode, or packaging image.