Sn97Cu3 solder bar

Sn97Cu3 solder bar
High-copper lead-free solder bar for special soldering and alloy applications requiring a higher melting point. Supplied in standard bar dimensions with export carton packaging for industrial soldering production.
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Sn97Cu3 Solder Bar

Sn97Cu3 solder bar is a high-copper tin alloy for specialty soldering, alloy adjustment and industrial processes requiring a significantly higher melting temperature.

Sn97Cu3Lead-free alloy
300°CMelting point
Bar SupplyWave, dip and tinning processes
Sn97Cu3 Solder Bar
Sn97Cu3 Solder Bar

High-copper solder bar for specialty alloy applications

This composition is not a general replacement for common Sn99.3Cu0.7 wave-soldering alloy. Its higher copper content and approximately 300°C melting point require process-specific equipment, flux and temperature validation.

01

3% Copper Content

High copper content supports specialty alloy and process requirements.

02

Approx. 300°C Melting Point

Designed for elevated-temperature applications rather than standard wave soldering.

03

Lead-Free Composition

Tin-copper chemistry without intentionally added lead.

04

Specialty Process Material

Suitable for controlled industrial use after validation.

05

Bar Form Supply

Convenient for melting, charging and alloy correction.

06

Engineering Confirmation

Equipment capability, flux and substrate compatibility must be confirmed before use.

Recommended Use

Recommended for specialty industrial joining, alloy adjustment, metal processing and applications where Sn97Cu3 is explicitly specified.

Product Specifications

Core data for initial product selection. Final alloy tolerance, bar size and packaging should be confirmed against the approved specification or purchase order.

Product Name
Sn97Cu3 Solder Bar
Alloy Model
Sn97Cu3
Alloy System
Sn-Cu
Melting Point
300°C
Standard Bar Dimension
34.5 × 1.5/2.0 × 1.6 cm
Typical Packaging
Approx. 700g per bar; 20kg/carton, subject to confirmed specification
Supply Form
Solder bar; other forms subject to alloy and order review
Customization
Alloy tolerance, impurity limits, dimensions and packaging available upon request

Typical Applications

Application suitability depends on the substrate finish, flux, solder-bath condition, temperature profile, joint design and reliability requirements.

Application 01Specialty Joining
Application 02Alloy Adjustment
Application 03Industrial Metal Processing
Application 04High-Temperature Applications

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