JL-CS-F01 Conductive Copper Paste
JL-CS-F01
Conductive Copper Paste
JL-CS-F01 is a single-component plug-type conductive resin material with excellent conductivity stability, low thermal expansion and strong adhesion. It is designed for high-performance electronics manufacturing, plug sealing and joint filling applications.
Conductive copper paste for plug sealing and joint filling.
JL-CS-F01 offers excellent conductivity stability and dimensional stability during processing and application.
Its low thermal expansion, crack resistance and adhesion performance make it suitable for demanding high-performance electronics manufacturing.
Low-Temperature Setting
Cures at 180℃ for 60 minutes under nitrogen atmosphere.
High Conductivity
Resistivity below 8×10⁻⁵ Ω·cm supports stable electrical performance.
Dimensional Stability
Low thermal expansion helps maintain stability during processing and application.
Halogen-Free
Clean and environmentally friendly formulation for electronic manufacturing.
Designed for conductive filling and sealing processes.
Compatible with dispensing and printing processes for plug sealing, joint filling and conductive connection applications.
Key data for engineering review and sample approval.
The following parameters support conductive paste evaluation, process selection and reliability testing.
| Item | Data | Test Method / Remark |
|---|---|---|
| Surface | Brown | Visual |
| Viscosity | 5–30 Pa·s | @20rpm; tested by viscometer |
| Solid Content | 100% | TGA |
| Resistivity | <8×10⁻⁵ Ω·cm | Four-point probe method |
| Glass Transition Temperature | 160–190℃ | TMA |
| CTE ( | 40–50ppm | TMA |
| CTE (>Tg) α2 | 110–130ppm | TMA |
| Total Expansion Rate at 260℃ | 1.5–2.0% | TMA |
| Adhesion | 100/100 | Hundred-grid method + 3M tape method |
| Condition of Cure | 180℃, 60min | Nitrogen atmosphere |
| Storage Temperature | -10℃ to 10℃ | Avoid light or high humidity |
| Quality Guarantee Period | 3 months | — |
Storage, thawing and application guidance.
This section gives buyers the handling basics before testing, because apparently even excellent materials dislike being mistreated. Sensible of them.
Storage
Store at -10℃ to 10℃ and avoid light or high-humidity environments.
Thawing
After removal from cold storage, place at room temperature around 25℃ for 4 hours to fully thaw.
Before Use
Wipe off moisture from the container before opening and use.
Application
Compatible with dispensing and printing for plug sealing and joint filling.
Compatible with dispensing and printing.
Designed for applications including conductive plug sealing and joint filling where process stability, adhesion and dimensional control are required.
Dispensing Process
Suitable for controlled application in local filling, sealing and conductive bonding areas.
Printing Process
Suitable for patterned deposition where consistent material coverage is needed.
Curing Process
Recommended cure condition: 180℃ for 60 minutes under nitrogen atmosphere.
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