Copper Cored Ball / 3D Package
Copper Cored Ball / 3D Package
Copper cored balls are designed for 3D package and advanced electronic interconnect applications. They help solve solder joint collapse or short-circuit issues caused by upper-level solder joints melting during multiple reflow processes.
Designed to control solder joint height during multiple reflow processes.
In 3D package and stacked package processes, repeated reflow may cause upper-level solder joints to melt again, leading to solder joint collapse or short circuit risk. Copper cored balls help maintain a more stable solder joint structure by using the copper core as a height-supporting structure during the soldering process.
Solder joint collapse in multi-reflow packages
During multiple reflows, upper-level solder joints may melt again. This can cause collapse, poor stand-off control, and short-circuit risk.
Copper core support for stable interconnects
The copper core provides structural support and helps maintain joint height, improving process stability in 3D package assembly.
3D Package Support
Designed for 3D package and stacked package soldering processes.
Collapse Control
Helps reduce solder joint collapse caused by repeated reflow melting.
Multiple Alloy Choices
Available with SAC305, Sn62Pb36Ag2, Sn42Bi57Ag1, and Sn63Pb37 alloy systems.
Standard Packaging
Standard packaging is 250k/pack according to the listed product table.
Available copper cored ball models
Each alloy is displayed as a separate product-style item. The image URL is temporarily reused and can be replaced later with copper cored ball, vial, reel, or packaging photos.
Quick technical matrix
For quick alloy comparison, the table below summarizes the model, diameter, volume availability and packaging information.
| Alloy Model | Diameter | Volume | Packaging |
|---|---|---|---|
| SAC305 (Sn96.5Ag3.0Cu0.5) | ≥0.05mm | Available | 250k/pack |
| Sn62Pb36Ag2 | ≥0.1mm | Available | 250k/pack |
| Sn42Bi57Ag1 | ≥0.1mm | Available | 250k/pack |
| Sn63Pb37 | ≥0.1mm | Available | 250k/pack |
For 3D package and multiple reflow soldering processes.
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