Copper Cored Ball / 3D Package
Copper Cored Ball / 3D Package
Copper core solder balls for controlled standoff height, reduced solder-joint collapse and advanced BGA, FCBGA, SiP and 3D semiconductor packaging.
Copper core solder balls for controlled advanced-package interconnects
Jufeng Solder supplies copper cored balls with different outer solder alloys for applications where post-reflow joint height, package spacing and collapse control matter. Final ball geometry is selected according to the package design and process requirement.
Copper Core Construction
A solid copper center is surrounded by the selected solder alloy coating.
Controlled Standoff Height
The core supports consistent separation between package and substrate after reflow.
Reduced Joint Collapse
The structure is designed to limit excessive solder ball collapse in compatible assembly processes.
Multiple Solder Coatings
Available product pages cover lead-free SAC305, tin-lead-silver, tin-bismuth-silver and tin-lead outer alloys.
Custom Ball Geometry
Core diameter, coating structure, overall diameter and packaging are confirmed by specification.
Advanced Packaging Focus
Suitable for engineering selection in BGA, FCBGA, SiP and 3D semiconductor packaging.
Series Overview
Use the overview below for initial product selection, then confirm the final model and process conditions.
How to Select
First select the outer solder alloy according to compliance and process-temperature requirements. Then confirm copper core size, total ball diameter, pad design, flux chemistry and reflow profile for the package.
Available Copper Cored Ball Models
The series includes SAC305 (Sn96.5Ag3.0Cu0.5), Sn62Pb36Ag2, Sn42Bi57Ag1 and Sn63Pb37 copper cored balls. Each model has a separate product page, with detail buttons temporarily set to # for backend replacement.
Copper Cored BallSAC305 (Sn96.5Ag3.0Cu0.5)
A lead-free SAC305 copper cored ball for 3D package assembly, package-level interconnect and controlled solder-joint height during multiple reflow processes.
Copper Cored BallSn62Pb36Ag2
A copper-cored solder ball with Sn62Pb36Ag2 outer solder alloy for controlled joint height in BGA, FCBGA, SiP and 3D semiconductor packaging.
Copper Cored BallSn42Bi57Ag1
A copper-cored solder ball with Sn42Bi57Ag1 outer alloy for controlled standoff and lower-temperature joining in selected BGA and 3D packaging applications.
Copper Cored BallSn63Pb37
A Sn63Pb37-coated copper core solder ball for controlled standoff height in BGA, FCBGA, SiP and 3D packaging processes using a tin-lead alloy system.
Typical Applications
Application suitability should be confirmed against the selected model, equipment and process requirements.
Need help selecting a copper cored ball?
Contact Jufeng Solder with your package type, required ball diameter, preferred outer alloy and application conditions.
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