Sn62Pb36Ag2 Copper Cored Ball / 3D Package
Sn62Pb36Ag2 Copper Cored Ball / 3D Package
A copper-cored solder ball with Sn62Pb36Ag2 outer solder alloy for controlled joint height in BGA, FCBGA, SiP and 3D semiconductor packaging.
Sn62Pb36Ag2 Copper Cored Ball / 3D Package
Sn62Pb36Ag2 copper cored ball combines a solid copper core with a tin-lead-silver solder coating. The core remains dimensionally stable during reflow and is used where controlled standoff height and reduced solder-joint collapse are important. Final core size, total ball diameter and coating structure must be confirmed by product specification.
Controlled Standoff Height
The copper core supports consistent post-reflow joint height for selected advanced packaging structures.
Copper Core Structure
A solid copper center provides the dimensional reference inside the solder-coated ball.
Sn62Pb36Ag2 Coating
Uses a silver-bearing tin-lead solder alloy around the copper core.
Reduced Collapse Risk
The core structure helps limit excessive joint collapse during compatible reflow processes.
Custom Diameter Support
Core diameter, outer diameter and packaging can be discussed according to the application.
Advanced Packaging Use
Suitable for engineering evaluation in BGA, FCBGA, SiP and 3D packaging projects.
Product Specifications
Core product information for engineering review, purchasing reference and quotation discussion.
Recommended Use
Recommended for BGA, FCBGA, SiP and 3D semiconductor packaging where a Sn62Pb36Ag2-coated copper core ball is required for controlled joint height. Confirm flux compatibility, pad finish, ball diameter and thermal profile before production.
Typical Applications
Final suitability should be confirmed against the selected product specification, equipment and process requirements.
Need Sn62Pb36Ag2 copper cored balls?
Contact Jufeng Solder to confirm core diameter, total ball diameter, coating alloy, packaging and process requirements.
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