Sn63Pb37 Copper Cored Ball / 3D Package
Sn63Pb37 Copper Cored Ball / 3D Package
A Sn63Pb37-coated copper core solder ball for controlled standoff height in BGA, FCBGA, SiP and 3D packaging processes using a tin-lead alloy system.
Sn63Pb37 Copper Cored Ball / 3D Package
Sn63Pb37 copper cored ball combines a copper core with a Sn63Pb37 solder coating. The structure is used to maintain controlled package-to-substrate spacing and reduce excessive joint collapse during compatible reflow assembly. Final dimensions and process parameters remain subject to the selected specification.
Sn63Pb37 Coating
Uses the established tin-lead alloy system around the copper core.
Stable Core Geometry
The copper center provides mechanical support during solder reflow.
Controlled Standoff
Designed for applications requiring more consistent post-reflow joint height.
Reduced Bridging Risk
Maintaining joint spacing can help reduce collapse-related short-circuit risk in suitable designs.
Custom Ball Dimensions
Core diameter and total ball diameter are available according to product specification.
Advanced Interconnect Use
Applicable to engineering evaluation for BGA, FCBGA, SiP and 3D packaging.
Product Specifications
Core product information for engineering review, purchasing reference and quotation discussion.
Recommended Use
Recommended for advanced packaging and reflow assembly projects that require a Sn63Pb37-coated copper core ball for controlled standoff. Confirm material compatibility, ball diameter, flux system and reflow conditions.
Typical Applications
Final suitability should be confirmed against the selected product specification, equipment and process requirements.
Need Sn63Pb37 copper cored balls?
Contact Jufeng Solder to confirm copper core geometry, solder coating, ball diameter and packaging for your assembly.
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