SAC305 (Sn96.5Ag3.0Cu0.5) Copper Cored Ball / 3D Package

SAC305 (Sn96.5Ag3.0Cu0.5) Copper Cored Ball / 3D Package
SAC305 (Sn96.5Ag3.0Cu0.5) copper cored ball is designed for 3D package assembly, package-level interconnect, reflow stand-off control, and solder joint reliability improvement. The copper core helps maintain joint height and reduce collapse risk during multiple reflows.
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SAC305 (Sn96.5Ag3.0Cu0.5) Copper Cored Ball / 3D Package

A lead-free SAC305 copper cored ball for 3D package assembly, package-level interconnect, reflow standoff control and solder-joint reliability improvement.

SAC305Sn96.5Ag3.0Cu0.5 coating
≥0.05 mmAvailable diameter
250k / PackTape & reel available
SAC305 (Sn96.5Ag3.0Cu0.5) Copper Cored Ball / 3D Package
SAC305 Copper Cored Ball

Copper core design for lead-free package interconnect and height control

This SAC305 copper cored ball combines a solid copper core with a Sn96.5Ag3.0Cu0.5 solder coating. It is designed for 3D package interconnect and reflow height control, helping maintain solder-joint height and reduce collapse-related short-circuit risk during multiple reflows.

01

Anti-Collapse Support

The copper core structure helps maintain solder-joint height during reflow.

02

Short-Circuit Risk Reduction

Designed to reduce bridging risk associated with excessive solder-joint collapse.

03

Multiple Reflow Stability

Suitable for package processes involving upper-level solder joints and repeated reflow cycles.

04

Lead-Free SAC305 Coating

Uses Sn96.5Ag3.0Cu0.5 as the outer solder alloy around the copper core.

05

Tape & Reel Option

Tape and reel packaging can be arranged for compatible automated placement processes.

06

Custom Volume Support

Custom product volume is available according to the selected specification.

Product Specifications

Core product and packaging information for engineering review and quotation.

Recommended Use

Recommended for 3D package assembly, package-level interconnect, PKG solder-joint support, multiple reflow processes and fine-pitch interconnects requiring a lead-free SAC305 copper cored ball.

Product Name
SAC305 (Sn96.5Ag3.0Cu0.5) Copper Cored Ball / 3D Package
Outer Solder Alloy
Sn96.5 / Ag3.0 / Cu0.5
Type
Lead-Free
Product Structure
Copper core with SAC305 solder alloy coating
Diameter
≥0.05 mm
Volume
Custom volume available
Primary Function
Maintain solder-joint height and reduce collapse-related short-circuit risk during multiple reflows
Packaging
250k / pack
Tape & Reel Packaging
Available
Typical Applications
3D package assembly, PKG solder-joint support, multiple reflow and fine-pitch interconnects

Typical Applications

Final suitability should be confirmed against package design, flux chemistry, placement method and reflow conditions.

Application 013D Package Assembly
Application 02PKG Solder-Joint Support
Application 03Multiple Reflow Processes
Application 04Fine-Pitch Interconnects

Need SAC305 copper cored balls for 3D packaging?

Contact Jufeng Solder to confirm diameter, volume, tape-and-reel requirements and process conditions.

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