Sn42Bi57Ag1 Copper Cored Ball / 3D Package
Sn42Bi57Ag1 Copper Cored Ball / 3D Package
Sn42Bi57Ag1 copper cored ball is designed for 3D package assembly, package-level interconnect, reflow stand-off control, and solder joint reliability improvement. The copper core helps maintain joint height and reduce collapse risk during multiple reflows.
Copper core design for solder joint height control.
This Sn42Bi57Ag1 copper cored ball is a low-temperature SnBiAg copper cored balls for temperature-sensitive 3D package assembly. Designed to solve solder joint collapse or short-circuit issues caused by melting of upper-level solder joints in PKG during multiple reflows.
Anti-Collapse Support
Copper core structure helps maintain solder joint height during reflow.
Short-Circuit Reduction
Designed to reduce collapse-related bridging risks in package assembly.
Multiple Reflow Stability
Suitable for processes involving upper-level solder joints and repeated reflow cycles.
Tape & Reel Option
Tape & Reel packaging can be arranged for automated placement processes.
Quick specification
| Product Name | Sn42Bi57Ag1 Copper Cored Ball / 3D Package |
| Diameter | ≥0.1mm |
| Volume | Custom volume available |
| Function | Designed to solve solder joint collapse or short-circuit issues caused by melting of upper-level solder joints in PKG during multiple reflows. |
| Packaging | 250k/pack; Tape & Reel package available |
For 3D package and package-level interconnect.
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