Sn42Bi57Ag1 Copper Cored Ball / 3D Package
Sn42Bi57Ag1 Copper Cored Ball / 3D Package
A copper-cored solder ball with Sn42Bi57Ag1 outer alloy for controlled standoff and lower-temperature joining in selected BGA and 3D packaging applications.
Sn42Bi57Ag1 Copper Cored Ball / 3D Package
Sn42Bi57Ag1 copper cored ball uses a copper core surrounded by a tin-bismuth-silver solder alloy. It is intended for projects that require controlled joint height together with a lower-temperature lead-free alloy direction. Final suitability depends on substrate finish, ball geometry, flux chemistry and the selected process profile.
Controlled Joint Height
The copper core provides a stable dimensional reference through the reflow process.
Low-Temperature Alloy Direction
Sn42Bi57Ag1 is selected for applications where reduced thermal exposure may be important.
Lead-Free Coating Alloy
The outer solder layer uses a tin-bismuth-silver composition without intentionally added lead.
Reduced Collapse Risk
The core structure helps maintain separation between package and substrate during compatible joining.
Custom Geometry Support
Core size, coating thickness and overall diameter are subject to product specification.
Packaging Evaluation
Suitable for BGA, FCBGA, SiP and selected 3D packaging engineering projects.
Product Specifications
Core product information for engineering review, purchasing reference and quotation discussion.
Recommended Use
Recommended for selected BGA, FCBGA, SiP and 3D packaging projects requiring a Sn42Bi57Ag1-coated copper core ball and reduced thermal exposure. Confirm reliability requirements and the complete process window before use.
Typical Applications
Final suitability should be confirmed against the selected product specification, equipment and process requirements.
Need Sn42Bi57Ag1 copper cored balls?
Contact Jufeng Solder to review the alloy, copper core size, total ball diameter and low-temperature process requirements.
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