Jufeng Bare-Copper Pressure Silver Sinter Paste Helps Reduce Costs for Automotive-Grade SiC Power Modules
Recently, the official launch of Xiaomi Auto SU7 attracted wide attention. The vehicle integrates a number of advanced technologies, including SiC power module technology. Under the global trend of automotive electrification, silicon carbide main drive systems are expected to become a standard configuration for new energy vehicles.
However, to fully unlock the performance of SiC modules, new packaging materials are required. Compared with traditional soft solder materials, nanosilver can more effectively improve the operating temperature and service life of power modules. Silver sintering technology can increase module lifetime by 5 to 10 times and improve thermal conductivity by 3 times.
With these advantages, silver sintering has become one of the mainstream packaging material solutions for SiC power modules. Still, the technology faces challenges such as high cost and dependence on imported materials and equipment. Cost reduction through domestic substitution has therefore become increasingly urgent.
Cost Pressure Behind SiC Power Module Packaging
The average market price of nanosilver materials starts from around this level, while automotive-grade materials are even more expensive.
Imported silver sintering equipment can cost this much, while the localization rate of equipment remains below 1%.
Current SiC power module prices are about 2 to 3 times higher than IGBT modules, making cost reduction essential for wider adoption.
JFPMAg-02: A Domestic Pressure Silver Sinter Paste Solution
Jufeng has launched the new JFPMAg-02 pressure silver sinter paste, which is expected to further support cost reduction and efficiency improvement for core components in new energy vehicles.
According to Jufeng, JFPMAg-02 demonstrates excellent processing performance and combines high performance with strong cost-effectiveness. Its upgraded formulation not only supports gold-plated and silver-plated surfaces, but also achieves a key breakthrough: direct sintering on bare copper surfaces.
Direct Sintering on Bare Copper Surfaces
Compared with traditional processes, JFPMAg-02 eliminates the need for expensive silver plating on ceramic substrates or lead frames. This significantly reduces material and processing costs while improving overall product performance.
Core Advantages of JFPMAg-02
Low-Temperature Pressure Sintering
JFPMAg-02 can achieve excellent bonding performance on various metal interfaces, including bare copper, under 200℃ pressure sintering conditions.
Strong Mechanical Strength
On copper substrates, its shear strength can reach twice that of competing products, ensuring stability and long-term reliability under harsh operating conditions.
Excellent Thermal Conductivity
With thermal conductivity exceeding 200 W/m·K, JFPMAg-02 supports fast and efficient thermal management in high-power-density applications.
High-Temperature Stability
The material can withstand demanding operating temperatures and maintain stable performance in high-temperature environments, which is critical for new energy vehicles.
Eco-Friendly Formulation
JFPMAg-02 adopts a lead-free and zero-halogen formulation, meeting modern environmental requirements while supporting product safety.
No-Clean Process
No flux residue cleaning is required, helping simplify production, save processing time and reduce manufacturing costs.
Wide Process Window
Its broad process compatibility allows it to adapt to commonly used process parameters, providing greater flexibility for production.
More Than Materials: Technical Support from Jufeng
Jufeng’s commitment is not limited to providing high-quality products. The company also provides comprehensive technical support and services.
The Jufeng expert team works closely with customers from material selection to final production process optimization, helping customers fully utilize the potential of JFPMAg-02 and meet specific application requirements.
A Cost-Effective Sintering Solution for Automotive-Grade SiC Modules
As SiC power modules continue to move toward higher power density and wider adoption, packaging material innovation will play an increasingly important role in cost reduction and reliability improvement.
JFPMAg-02 pressure silver sinter paste provides a practical solution for bare copper bonding, high thermal conductivity, strong mechanical reliability and process efficiency, helping support the next stage of automotive-grade SiC technology development.
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