Jufeng Launches Key Large‑Area Silver Sintering Technology for SiC Power Modules
In the past two years, international silver prices have risen strongly, breaking through USD 120 per ounce and remaining at high levels for a prolonged period. This has significantly increased the cost and operating pressure for manufacturers using silver-based materials.
At the same time, with the rapid growth of smart wearables, flexible sensors and other terminal products, flexible printed electronics processes such as screen printing and dispensing have become core solutions for lightweight and flexible circuit mass production.
As market demand continues to expand, the industry has long faced a material selection dilemma: it is difficult to balance conductivity performance and production cost.
High Performance, High Cost
Although silver-based conductive pastes offer strong performance, the price fluctuation and high cost of precious metal raw materials severely compress the profit margin of downstream manufacturers.
Lower Cost, Limited Reliability
Traditional copper pastes have cost advantages, but copper powder is prone to oxidation. Insufficient resin heat resistance and solderability may lead to conductivity decay, poor reliability and solder joint failure.
To solve this challenge, Joinspire developed JL-CS01 solderable conductive copper paste, a mature solution designed to reduce cost while improving stability for flexible electronics mass production.
JL-CS01 Breaks the Balance Problem Between Performance and Cost
Based on independent formulation development and process technology, Joinspire launched JL-CS01 solderable conductive copper paste. It overcomes the performance limitations of traditional copper paste and avoids the high-cost pressure of silver paste, providing a high-cost-performance and high-stability solution for flexible electronics manufacturing.
Reducing Material Procurement Cost by About 30%
For users in the flexible circuit industry, choosing JL-CS01 means direct raw material cost advantages and better risk control.
Lower Material Cost
JL-CS01 adopts an independently developed silver-free formulation, eliminating dependence on precious metal raw materials and helping manufacturers reduce raw material procurement cost by about 30% compared with traditional conductive silver paste.
Higher Overall Yield
With low-temperature rapid curing and improved reliability, JL-CS01 helps reduce product scrap caused by conductivity decay and substrate deformation, improving production efficiency from the process side.
Global Compliance
JL-CS01 is lead-free and halogen-free, and has passed RoHS and REACH environmental compliance requirements, supporting global green export standards.
Four Core Performance Advantages for High-End Production
1. Wide Process Compatibility and Stable Continuous Production
JL-CS01 is fully compatible with mainstream processes such as screen printing and automated dispensing. The product features uniform powder dispersion, excellent anti-settling and anti-delamination performance, helping avoid process defects such as screen clogging, stringing, overflow and circuit breakage.
With precise rheological process control, JL-CS01 can stably achieve fine processing with 0.1 mm line width and spacing, meeting the requirements of precision flexible circuits and micro sensor electrodes.
2. Excellent Bending Resistance and Stable Conductivity Under Deformation
JL-CS01 offers a volume resistivity as low as 8×10-5 Ω·cm, providing low-resistance conduction. Standardized testing shows that the cured layer reaches 5B adhesion according to ASTM D3359-09 cross-hatch testing. Under R2 bending radius and 10,000 reciprocating bending cycles, the resistivity change rate remains strictly controlled within industry standards.
3. 150℃ Low-Temperature Rapid Curing for Flexible Substrates
Most flexible substrates, such as PET and PI, are thin and sensitive to high temperatures. High-temperature curing may easily cause substrate deformation and product scrap. JL-CS01 supports rapid curing at 150℃ for 15 minutes, effectively reducing substrate deformation and production loss caused by high-temperature processing.
4. Reliable Solderability for Downstream Assembly and Repair
JL-CS01 solves the long-standing problem of poor solderability in traditional conductive pastes, such as weak solder joints and solder joint detachment. It is compatible with lead-free solder paste and low-temperature solder materials. After soldering, the joints are full, firm and resistant to oxidation and peeling, helping reduce the repair rate in flexible circuit assembly.
Suitable for Multiple Flexible Electronics Mass Production Scenarios
Flexible Printed Circuits
JL-CS01 can replace traditional conductive pastes, helping ensure printing yield and circuit stability while significantly reducing mass production cost pressure.
Flexible Sensors
JL-CS01 is suitable for electrode fabrication in pressure, temperature, humidity and other flexible sensors. It offers excellent bending resistance, anti-aging performance and stable signal transmission for long-term sensor reliability.
FPC Flexible Circuit Boards
JL-CS01 is suitable for spare pads, auxiliary jumper structures, reinforced contacts and other areas requiring secondary soldering and high-frequency bending, helping solve solder joint detachment and deformation failure in FPC mass production.
Conclusion
In the past, the industry often had to compromise between expensive silver paste and easily oxidized traditional copper paste. The conflict between performance and cost became a major pain point for many manufacturers in mass production.
Today, the launch of JL-CS01 solderable conductive copper paste successfully breaks this material selection dilemma. As a mature solution combining high cost performance and high stability, JL-CS01 helps reduce mass production cost pressure and is expected to become a new standard in the development of flexible printed electronics.
Joinspire will continue to promote the large-scale application of JL-CS01 in more fields, providing more cost-effective and reliable new material solutions for the industry.
JL-CS01 Solderable Conductive Copper Paste
A silver-free conductive copper paste solution for flexible printed circuits, FPC boards, flexible sensors and other high-reliability printed electronics applications.
Farewell to Traditional Etching: Jufeng Solderable Conductive Copper Paste Usher in a New Era of Green RFID Manufacturing
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