Sn70Pb30 solder bar

Sn70Pb30 solder bar
Tin-lead solder bar with Sn70Pb30 alloy composition, designed for soldering, tinning, and industrial electronic assembly processes where Sn-Pb solder alloy is specified. Supplied in standard bar dimensions with export carton packaging for production use.
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Sn70Pb30 Lead Solder Bar

Sn70Pb30 is a higher-tin tin-lead solder bar designed for controlled soldering, tinning and industrial electronics processes where a 70/30 Sn-Pb composition is specified.

Sn70Pb30Tin-lead alloy
Approx. 183–195°CMelting point / range
Bar SupplyWave, dip and tinning processes
Sn70Pb30 Lead Solder Bar
Sn70Pb30 Lead Solder Bar

Higher-tin Sn-Pb solder bar for controlled production

With a higher tin content than many conventional leaded bar alloys, Sn70Pb30 provides a comparatively lower liquidus temperature and practical wetting performance for compatible materials and processes.

01

70% Tin Composition

Higher tin content supports suitable solderability and flow characteristics.

02

Controlled Melting Behavior

Approximate 183–195°C phase-change range for defined Sn-Pb process design.

03

Wave & Dip Compatibility

Suitable for solder pots, wave soldering and dip soldering after process validation.

04

Consistent Alloy Control

Composition inspection supports stable production and bath replenishment.

05

Standard Bar Dimensions

Supplied in practical bar form for handling and melting.

06

Export Supply Support

Carton packing, batch documents and OEM requirements can be discussed.

Recommended Use

Recommended for wave soldering, dip soldering, tinning, alloy replenishment and industrial electronics assembly where Sn70Pb30 is required.

Product Specifications

Core data for initial product selection. Final values must be confirmed against the approved specification, batch document or purchase order.

Product Name
Sn70Pb30 Lead Solder Bar
Alloy Composition
Sn 70% / Pb 30%
Alloy System
Higher-tin Sn-Pb
Melting Point / Range
Approx. 183–195°C
Standard Bar Dimension
34.5 × 1.5/2.0 × 1.6 cm
Packaging
Standard export carton; typically 25 kg/carton, subject to confirmed specification
Supply Options
Standard bar / custom dimension / OEM packing subject to order review
Compliance Note
Leaded alloy. Use only where permitted by applicable regulations and end-use requirements.

Typical Applications

Application suitability depends on substrate finish, flux selection, solder bath condition, temperature profile, joint design and regulatory requirements.

Application 01Wave Soldering
Application 02Dip Soldering
Application 03Component Tinning
Application 04Industrial Electronics

Explore Tin Lead Solder Bar Options

Compare related tin-lead bar alloys within the Jufeng solder bar series.

Technical information is provided for product-selection reference. Tin-lead solder is regulated in many markets; confirm legal use, process suitability and reliability requirements before ordering.

Need a tin-lead solder bar specification?

Send the required alloy, bar dimension, application, soldering process, packaging and annual demand for technical review and quotation.

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