Sn30Pb70 solder bar

Sn30Pb70 LEAD SOLDER BAR
Tin-lead solder bar with Sn30Pb70 alloy composition, designed for soldering, tinning, and industrial electronic assembly processes where Sn-Pb solder alloy is specified. Supplied in standard bar dimensions with export carton packaging for production use.
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Sn30Pb70 Solder Bar

A high-lead tin-lead solder bar designed for higher-temperature industrial soldering, tinning and staged joining where a lower-tin Sn-Pb composition is specified.

Sn30Pb70Tin-lead alloy
Approx. 183–257°CMelting point / range
Bar SupplyWave, dip and tinning processes
Sn30Pb70 Solder Bar
Sn30Pb70 Solder Bar

High-lead solder bar for elevated-temperature processing

The lower tin content raises the liquidus temperature and supports selected industrial applications that require a higher-temperature alloy than common 63/37 or 60/40 solder.

01

High-Lead Alloy System

Lower tin content provides a higher liquidus temperature for suitable applications.

02

Step-Soldering Potential

Can support staged joining where the first joint must tolerate a later lower-temperature operation.

03

Industrial Tinning

Applicable to selected metal components, terminals and production solder pots.

04

Stable Alloy Supply

Composition control supports repeatable batch performance.

05

Bar Form Handling

Convenient for melting, replenishment and production storage.

06

Technical Confirmation

Final process suitability should be validated with actual parts, flux and equipment.

Recommended Use

Recommended for higher-temperature solder pots, industrial tinning, staged soldering, electrical components and specialty repair where the selected Sn-Pb alloy is permitted.

Product Specifications

Core data for initial product selection. Final values must be confirmed against the approved specification, batch document or purchase order.

Product Name
Sn30Pb70 Solder Bar
Alloy Composition
Sn 30% / Pb 70%
Alloy System
High-lead Sn-Pb
Melting Point / Range
Approx. 183–257°C
Standard Bar Dimension
34.5 × 1.5/2.0 × 1.6 cm
Packaging
Standard export carton; typically 25 kg/carton, subject to confirmed specification
Supply Options
Standard bar / custom dimension / OEM packing subject to order review
Compliance Note
Leaded alloy. Use only where permitted by applicable regulations and end-use requirements.

Typical Applications

Application suitability depends on substrate finish, flux selection, solder bath condition, temperature profile, joint design and regulatory requirements.

Application 01High-Temperature Tinning
Application 02Step Soldering
Application 03Electrical Components
Application 04Industrial Solder Pots

Explore Tin Lead Solder Bar Options

Compare related tin-lead bar alloys within the Jufeng solder bar series.

Technical information is provided for product-selection reference. Tin-lead solder is regulated in many markets; confirm legal use, process suitability and reliability requirements before ordering.

Need a tin-lead solder bar specification?

Send the required alloy, bar dimension, application, soldering process, packaging and annual demand for technical review and quotation.

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