Sn45Pb55 solder bar

Sn45Pb55 LEAD SOLDER BAR
Tin-lead solder bar with Sn45Pb55 alloy composition, designed for soldering, tinning, and industrial electronic assembly processes where Sn-Pb solder alloy is specified. Supplied in standard bar dimensions with export carton packaging for production use.
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Sn45Pb55 Solder Bar

A medium-to-higher-lead tin-lead solder bar for industrial soldering, metal tinning and processes requiring a higher liquidus temperature than Sn63Pb37 or Sn60Pb40.

Sn45Pb55Tin-lead alloy
Approx. 183–227°CMelting point / range
Bar SupplyWave, dip and tinning processes
Sn45Pb55 Solder Bar
Sn45Pb55 Solder Bar

Tin-lead solder bar for higher-temperature industrial processes

This alloy is selected where a lower tin content and higher processing temperature suit the production requirement. Actual performance depends on flux, substrate, bath condition and operating profile.

01

Higher Liquidus Temperature

Supports selected processes requiring more thermal resistance than common eutectic solder.

02

Industrial Alloy Option

Suitable for defined tinning, dip soldering and metal-joining applications.

03

Stable Bar Geometry

Convenient for solder pot handling and replenishment.

04

Composition Control

Raw material and alloy checks support consistent batches.

05

Process Flexibility

Can be evaluated with different flux systems and compatible substrates.

06

Export & OEM Supply

Packaging, labeling and documentation can be discussed for qualified orders.

Recommended Use

Recommended for industrial dip soldering, metal tinning, electrical assembly, maintenance and solder-pot processes where the selected alloy is specified.

Product Specifications

Core data for initial product selection. Final values must be confirmed against the approved specification, batch document or purchase order.

Product Name
Sn45Pb55 Solder Bar
Alloy Composition
Sn 45% / Pb 55%
Alloy System
Medium-lead Sn-Pb
Melting Point / Range
Approx. 183–227°C
Standard Bar Dimension
34.5 × 1.5/2.0 × 1.6 cm
Packaging
Standard export carton; typically 25 kg/carton, subject to confirmed specification
Supply Options
Standard bar / custom dimension / OEM packing subject to order review
Compliance Note
Leaded alloy. Use only where permitted by applicable regulations and end-use requirements.

Typical Applications

Application suitability depends on substrate finish, flux selection, solder bath condition, temperature profile, joint design and regulatory requirements.

Application 01Industrial Tinning
Application 02Electrical Assembly
Application 03Dip Soldering
Application 04Metal Joining

Explore Tin Lead Solder Bar Options

Compare related tin-lead bar alloys within the Jufeng solder bar series.

Technical information is provided for product-selection reference. Tin-lead solder is regulated in many markets; confirm legal use, process suitability and reliability requirements before ordering.

Need a tin-lead solder bar specification?

Send the required alloy, bar dimension, application, soldering process, packaging and annual demand for technical review and quotation.

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