Sn63Pb37 solder bar
Sn63Pb37 Solder Bar
Sn63Pb37 is a eutectic tin-lead solder bar with a single 183°C melting temperature, supporting rapid melting, short solidification transition and repeatable soldering behavior in suitable electronics processes.

Eutectic solder bar for stable electronics assembly
The 63/37 tin-lead composition is widely recognized for its sharp phase transition. It is used where a defined eutectic alloy, good wetting and consistent process control are required and where leaded solder remains permitted.
Eutectic 183°C Alloy
A single melting temperature reduces the pasty range during heating and cooling.
Reliable Wetting
Suitable flux and process control can support clean spreading on compatible solderable surfaces.
Stable Bath Control
A defined alloy composition supports wave and dip soldering bath management.
Low-Dross Process Support
Controlled impurities and appropriate operating conditions help limit unnecessary oxidation and dross.
Standard Bar Supply
Bar form is convenient for solder pot replenishment and production handling.
OEM & Batch Support
Alloy verification, packaging and supply arrangements can be discussed for qualified projects.
Recommended Use
Recommended for wave soldering, dip soldering, solder pot replenishment, PCB assembly and tinning processes where Sn63Pb37 is technically specified and legally permitted.
Product Specifications
Core data for initial product selection. Final values must be confirmed against the approved specification, batch document or purchase order.
Typical Applications
Application suitability depends on substrate finish, flux selection, solder bath condition, temperature profile, joint design and regulatory requirements.
Explore Tin Lead Solder Bar Options
Compare related tin-lead bar alloys within the Jufeng solder bar series.
Technical information is provided for product-selection reference. Tin-lead solder is regulated in many markets; confirm legal use, process suitability and reliability requirements before ordering.
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