Sn5Pb93.5Ag1.5 Tin Lead Solder Wire
Sn5Pb93.5Ag1.5 Tin Lead Solder Wire
A silver-containing high-lead solder wire for semiconductor assembly, high-temperature joining and specialty electronic packaging.
High-lead silver solder wire for specialty electronic joining
Sn5Pb92.5Ag2.5 combines a high lead content with silver addition. It is evaluated for high-temperature joining, power semiconductor assembly and staged processes where a high remelt temperature is required.
Sn-Pb-Ag Alloy
Silver addition distinguishes this alloy from conventional binary high-lead wire.
High Melting Performance
Approximately 287°C melting behavior supports selected high-temperature processes.
Semiconductor Applications
Suitable for evaluation in power devices and specialty electronic packaging.
Step-Soldering Use
High remelt temperature can support suitable staged joining sequences.
Controlled Specification
Alloy tolerance, wire diameter and flux system require project confirmation.
Technical Supply Support
Samples, packaging and documentation can be discussed for qualified projects.
Product Specifications
Reference information for initial selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.
Recommended Use
Recommended for selected power semiconductor, specialty electronic packaging and step-soldering applications where the alloy is specified and legally permitted.
Typical Applications
Application suitability depends on substrate finish, component design, flux selection, soldering equipment, process temperature and regulatory requirements.
Explore Tin Lead Solder Wire Options
Compare related alloys within the Jufeng tin-lead solder wire series.
Technical information is provided for product-selection reference. Tin-lead solder is regulated in many markets; confirm legal use, process suitability and reliability requirements before ordering.
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