Sn70Pb30 Tin Lead Solder Wire

Sn70Pb30
Sn70Pb30 tin lead solder wire is a tin-rich leaded solder alloy designed for electronic soldering, repair, and general assembly applications. With a melting point of approximately 195°C and available diameter from 0.38mm, it provides good solderability, smooth flow, and reliable joint formation for conventional tin-lead soldering processes.
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Sn70Pb30
Tin Lead Solder Wire

Sn70Pb30 tin lead solder wire is a tin-rich leaded solder alloy designed for electronic soldering, repair, and general assembly applications. With a melting point of approximately 195°C and available diameter from 0.38mm, it provides good solderability, smooth flow, and reliable joint formation for conventional tin-lead soldering processes.

Alloy
Sn70Pb30
Melting Point
195°C
Diameter
≥0.38mm
Type
Tin Lead

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Sn70Pb30 Tin Lead Solder Wire
Product Overview

A tin-rich leaded solder wire for smooth soldering.

Sn70Pb30 solder wire contains a higher tin ratio than standard Sn60Pb40 or Sn63Pb37 solder wire. It offers good wetting behavior, clean solder joint appearance, and stable soldering performance. This alloy is suitable for manual soldering, PCB repair, electronic maintenance, and applications requiring a tin-lead solder wire with good flow characteristics.

Tin-Rich Alloy

Higher tin content supports good wetting and smooth solder flow.

Good Solderability

Suitable for common tin-lead electronic soldering processes.

Reliable Joint Formation

Helps form clean and stable solder joints during repair and assembly.

Flexible Supply

Available in multiple wire diameters, flux types, and packaging formats.

Technical Data

Sn70Pb30 solder wire specifications.

Core product parameters for quick evaluation and RFQ communication.

ItemSpecificationDescription
Product NameSn70Pb30 Tin Lead Solder WireTin-rich leaded solder wire
Alloy CompositionSn70 / Pb30Tin-lead solder alloy
Melting Point195°CCatalog value for Sn70Pb30 solder wire
Minimum Diameter≥0.38mmSuitable for general electronic soldering
Wire TypeFlux Cored / Solid Core OptionalCan be selected according to soldering process
Flux TypeRosin Core / No-Clean OptionalCustom flux formulation available
SurfaceBright and smoothSupports stable feeding and soldering
PackagingTube / Spool / Carton10g per tube; 100g–2000g per roll; carton packaging available
Applications

Designed for general tin-lead soldering.

Sn70Pb30 solder wire is suitable for conventional electronic soldering where good wetting and stable solder joint appearance are required.

PCB Assembly

Used for component soldering, through-hole soldering, and circuit board repair.

Electronic Repair

Suitable for repair stations, maintenance, and manual soldering.

Consumer Electronics

Used for common electronic devices and assemblies.

Electrical Components

Suitable for terminals, connectors, and small electronic parts.

Packaging

Flexible packaging for sampling and production.

Packaging can be selected according to wire diameter, order quantity, and shipping requirements.

Tube Packaging

10g per tube, suitable for samples, maintenance, and small-quantity use.

Spool Packaging

100g / 200g / 250g / 500g / 1000g / 2000g per roll available.

Carton Packaging

10 rolls per carton box; box size: 38 × 16.5 × 25cm; three boxes per carton.

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