Sn70Pb30 Tin Lead Solder Wire
Sn70Pb30 Tin Lead Solder Wire
A higher-tin 70/30 tin-lead solder wire for electronic soldering, repair and general assembly where leaded alloy use remains permitted.
Higher-tin solder wire for practical electronics assembly
Sn70Pb30 contains more tin than common 63/37 and 60/40 alloys. It offers practical wetting behavior and a relatively low melting range for compatible electrical and electronic joining tasks.
70% Tin Content
Higher tin content supports practical wetting on compatible solderable surfaces.
Low Melting Range
Approximate 183–195°C behavior supports familiar electronics soldering temperatures.
Manual & Machine Feeding
Multiple diameter options can support hand or equipment solder feeding.
Flux Options
Rosin-core, no-clean and selected custom systems may be reviewed.
General Assembly Use
Suitable for compatible electronics, electrical and repair operations.
Flexible Supply
Tube, spool, carton and OEM packaging options are available.
Product Specifications
Reference information for initial selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.
Recommended Use
Recommended for electronic assembly, repair, electrical connections and general soldering where Sn70Pb30 is specified and permitted.
Typical Applications
Application suitability depends on substrate finish, component design, flux selection, soldering equipment, process temperature and regulatory requirements.
Explore Tin Lead Solder Wire Options
Compare related alloys within the Jufeng tin-lead solder wire series.
Technical information is provided for product-selection reference. Tin-lead solder is regulated in many markets; confirm legal use, process suitability and reliability requirements before ordering.
Need a tin-lead solder wire specification?
Send the required alloy, wire diameter, flux type, spool weight, application and annual demand for technical review and quotation.
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